Abstract:
A mobile terminal having a structure increasing heat dissipation efficiency, including a printed circuit board (PCB) disposed within a terminal body and having a heating element which generates heat mounted thereon, a frame having a space formed on one surface thereof and allowing the PCB to be installed therein, and a heat pipe supported by the frame, disposed on one surface of the frame, and connected to the PCB to dissipate heat generated by the heating element outwardly from the terminal body, wherein the frame includes a hold portion extending from an end portion thereof to cover at least a portion of the heat pipe in order to prevent the heat pipe from being released from the frame by external force applied to the terminal body.
Abstract:
There is disclosed a mobile terminal including a display panel, a frame comprising a front surface where the display panel is disposed, a rear case coupled to one surface of the frame, to form an electric/electronic control unit there between the frame and the rear case, a heat spreader module provided between the display panel and the frame, wherein the heat spreader module includes a metallic plate in contact with the display panel, a heat spreading material layer disposed on a rear surface of the metallic plate and an adhesive layer disposed between the heat spreading material layer and the metallic plate to bond the metallic plate and the heat spreading material layer with each other. Even when the frame is partially eliminated, the mobile terminal may support the display panel and securing the heat spreading performance simultaneously, using the heat spreader module having a preset rigidity.