公开(公告)号：US4316757A

公开(公告)日：1982-02-23

申请号：US126807

申请日：1980-03-03

申请人： Robert J. Walsh

发明人： Robert J. Walsh

IPC分类号： B32B37/00 ,  B24B37/30 ,  B28D5/00 ,  H01L21/302 ,  H01L21/68 ,  B32B31/22

CPC分类号： H01L21/02024 ,  B24B37/30 ,  B28D5/0082

摘要： Apparatus and method for wax mounting of thin wafers such as slices of semiconductor silicon to a carrier for polishing wherein the carrier is heated after being coated with wax which is maintained in a sticky condition by the heated carrier. A chamber is utilized for enclosing the thin wafers on resilient supports with the sticky wax-coated, heated carrier disposed above them. The chamber has an air tight seal permitting it to be evacuated. After evacuation a pneumatic cylinder is utilized to press the carrier against the wafers, which adhere to the sticky wax coating. The chamber is vented then to atmospheric pressure, the wafers remaining mounted by the wax coating to the carrier for subsequent polishing. The method avoids entrapment of gas bubbles between wafers and carrier.

摘要翻译： 用于将诸如半导体硅片的薄晶片蜡安装到用于抛光的载体上的装置和方法，其中载体在被加热的载体保持在粘性状态的蜡涂覆之后被加热。 利用一个腔室将薄晶片封装在弹性支撑件上，其上涂有蜡状涂蜡的加热载体。 该室具有允许其排空的气密密封。 撤离后，使用气动缸将载体压靠在粘附到粘性蜡涂层上的晶片上。 然后将腔室排放到大气压力，晶片通过蜡涂层保持安装到载体上用于随后的抛光。 该方法避免了晶片和载体之间的气泡夹带。

公开(公告)号：US4313284A

公开(公告)日：1982-02-02

申请号：US134714

申请日：1980-03-27

申请人： Robert J. Walsh

发明人： Robert J. Walsh

IPC分类号： H01L21/304 ,  B24B37/015 ,  B24B37/30 ,  B24B49/14 ,  B24B55/02 ,  H01L31/00 ,  B24B7/04

CPC分类号： B24B37/30 ,  B24B37/015 ,  B24B55/02

摘要： Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.

摘要翻译： 用于通过将晶片安装到通过弹性装置安装到可转动压板上的可变形薄板载体上来改善抛光晶片平坦度的诸如半导体材料切片的装置，该组合安装件可转动地与可旋转的转盘支撑的抛光表面接合， 转盘具有远离安装的晶片的边缘弓的旋转轴线。 载体变形成朝向弓台开口的凹形; 从而允许安装的晶片通过旋转抛光实现，均匀地提高平坦度。

公开(公告)号：US3979239A

公开(公告)日：1976-09-07

申请号：US537478

申请日：1974-12-30

申请人： Robert J. Walsh

发明人： Robert J. Walsh

IPC分类号： H01L21/304 ,  H01L21/306 ,  H01L21/308

CPC分类号： H01L21/02024 ,  Y10S438/959

摘要： Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydrochloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface.

摘要翻译： 通过将弱酸性盐酸溶液与水性氯源结合施加到待抛光表面同时机械抛光表面，来对III-V半导体平面表面进行组合化学机械抛光的方法。