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公开(公告)号：US20200051894A1
公开(公告)日：2020-02-13
申请号：US16100406
申请日：2018-08-10
Applicant: Intel Corporation
Inventor： Zhimin Wan , Je-Young Chang , Chia-Pin Chiu , Shankar Devasenathipathy , Betsegaw Kebede Gebrehiwot , Chandra Mohan Jha
IPC: H01L23/427 , H01L25/18
Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
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