公开(公告)号：US20070096287A1

公开(公告)日：2007-05-03

申请号：US11582328

申请日：2006-10-18

申请人： Makoto Araki ,  Masakatsu Goto ,  Shigeru Nakamura

发明人： Makoto Araki ,  Masakatsu Goto ,  Shigeru Nakamura

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00

摘要： Packaging performance of a semiconductor device is improved. A semiconductor device has a package substrate having a base material formed of resin; a semiconductor chip mounted on a main surface of the package substrate; a tape substrates being stacked on the package substrate in several stages, and electrically connected to a substrate at a lower stage via a plurality of solder balls; a second-stage chip, third-stage chip, and fourth-stage chip mounted on the tape substrates at respective stages; and a plurality of solder balls provided on a back surface of the package substrate; wherein a sealing body, which resin-seals the semiconductor chip and is formed by resin molding, is formed on a main surface of a package substrate disposed at the lowest stage, and the sealing body is disposed between the package substrate at the lowest stage and the tape substrate stacked thereon.

摘要翻译： 提高了半导体器件的封装性能。 半导体器件具有由树脂形成的基材的封装基板; 安装在所述封装基板的主表面上的半导体芯片; 带状基板分几层堆叠在封装基板上，并通过多个焊球在较低级电连接到基板; 第二级芯片，第三级芯片和第四级芯片，分别安装在磁带基板上; 以及设置在所述封装基板的背面上的多个焊球; 其特征在于，在设置在最下层的封装基板的主表面上形成有通过树脂成形形成树脂密封半导体芯片的密封体，密封体设置在最底层的封装基板和 所述带基材堆叠在其上。

公开(公告)号：US06276149B1

公开(公告)日：2001-08-21

申请号：US09767732

申请日：2001-01-24

申请人： Masashi Katayama ,  Makoto Araki ,  Masaki Fujino ,  Jyunya Tanaka ,  Motonobu Furukawa ,  Akira Shimada ,  Shuji Takeda ,  Hiroki Tomoda ,  Mitsuru Shiraishi ,  Keiichi Nakamura ,  Takefumi Inagaki

发明人： Masashi Katayama ,  Makoto Araki ,  Masaki Fujino ,  Jyunya Tanaka ,  Motonobu Furukawa ,  Akira Shimada ,  Shuji Takeda ,  Hiroki Tomoda ,  Mitsuru Shiraishi ,  Keiichi Nakamura ,  Takefumi Inagaki

IPC分类号： F25B1300

摘要： In an air conditioner having a refrigerant circuit in which a compressor, a four-way switching valve, an outdoor-side heat exchanger, an expansion valve, and an indoor-side heat exchanger are connected in succession via pipes, the interior of an enclosed vessel of a compressor, which contains a refrigerant compressing section and an electric motor, is divided airtightly into a refrigerant discharge chamber and an electric motor chamber, two refrigerant flow path pipes are provided on the electric motor chamber side, and these refrigerant flow path pipes are appropriately switched to the refrigerant discharge side and the refrigerant suction side of the compressor via the four-way switching valve, whereby one compressor can be used as an internal high pressure type or an internal low pressure type.