Abstract:
Disclosed is a structure for precision control of electrical impedance of signal transmission circuit board. A substrate forms thereon a plurality of first signal transmission lines, and a first covering insulation layer is formed on a first surface of the substrate to cover a surface of each first signal transmission lines and each spacing section formed between adjacent first signal transmission lines. Each first signal transmission lines can transmit a differential mode signal or a common mode signal. At least one first flattening insulation layer is formed between a surface of the first covering insulation layer and a first conductive shielding layer so that the first flattening insulation layer fills up the height difference between the surface of each first signal transmission line and the spacing section associated with each first signal transmission line to thereby ensure a consistent distance between the signal transmission lines and the conductive shielding layer for realizing precision control of electrical impedance of the signal transmission circuit board.
Abstract:
Disclosed is a detachment and displacement protection structure for insertion of flexible circuit flat cable. An inserter positioning section is formed on a flexible circuit flat cable and coupled with an inserter, which includes a metal member and a plastic member. In assembling, the plastic member is first positioned on a first surface of the inserter positioning section of the flexible circuit flat cable, and then the metal member is fit over the plastic member. A detachment and displacement protection structure is provided on the inserter positioning section to constrain the inserter from displacing and detaching in a flat cable extension direction due to being acted upon by an external force when the inserter is positioned on the inserter positioning section.
Abstract:
A flexible printed circuit board with waterproof structure includes a flexible substrate that has a first surface having a first metal layer bonded thereon. The first metal layer forms a covered area and at least one mounting zone. A bonding strength enhancing structure is formed on the mounting zone. A first insulation layer is formed on the covered area of the upper surface of the first metal layer in such a way to expose the mounting zone. A water resistant member is bonded to the bonding strength enhancing structure and a second surface of the flexible substrate.