公开(公告)号：US20210187910A1

公开(公告)日：2021-06-24

申请号：US16757727

申请日：2018-10-24

Applicant: Corning Incorporated

Inventor： Robert George Manley ,  Rajesh Vaddi

IPC: B32B17/10 ,  C03C23/00 ,  C03C15/00 ,  B32B3/26 ,  B32B27/06 ,  B32B27/28 ,  B32B27/30 ,  H01L21/768

Abstract: A sub-assembly includes a glass substrate, a plurality of electronic devices, and a passivation layer. The glass substrate includes a first surface, a second surface opposite to the first surface, and a third surface extending between the first surface and the second surface. The glass substrate includes a plurality of laser damaged regions extending from the first surface to the second surface. The plurality of electronic devices are on the first surface of the glass substrate. The passivation layer is on the plurality of electronic devices and the third surface of the glass substrate. The passivation layer includes an opening to each laser damaged region of the plurality of laser damaged regions.

公开(公告)号：US10424606B1

公开(公告)日：2019-09-24

申请号：US15972628

申请日：2018-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Daniel Wayne Levesque, Jr. ,  Robert George Manley ,  Garrett Andrew Piech ,  Rajesh Vaddi ,  Heather Nicole Vanselous

IPC: H01L27/12 ,  H01L27/15

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.