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公开(公告)号：US20210282301A1
公开(公告)日：2021-09-09
申请号：US16928279
申请日：2020-07-14
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Mandy Hin Lam , Mark Nowell , Rakesh Chopra
Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.
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公开(公告)号：US20210235597A1
公开(公告)日：2021-07-29
申请号：US16922177
申请日：2020-07-07
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Chopra , M. Baris Dogruoz , Mark Nowell , Mandy Hin Lam
Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.
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公开(公告)号：US20210219415A1
公开(公告)日：2021-07-15
申请号：US16743371
申请日：2020-01-15
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Joel Richard Goergen , Jessica Kiefer , Ashley Julia Maker Erickson , Yi Tang , M. Baris Dogruoz , Elizabeth Ann Kochuparambil , Shobhana Punjabi
Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.
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公开(公告)号：US12200906B2
公开(公告)日：2025-01-14
申请号：US17503875
申请日：2021-10-18
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz , Joel Richard Goergen
IPC: H05K7/20
Abstract: A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.
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公开(公告)号：US20240175650A1
公开(公告)日：2024-05-30
申请号：US18427369
申请日：2024-01-30
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Mehmet Onder Cap , D. Brice Achkir , Joel Richard Goergen
CPC classification number: F28F21/02 , F28D21/00 , F28F3/04 , F28D2021/0029 , F28F2280/06
Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.
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Patent Agency Ranking
公开(公告)号：US11917793B2
公开(公告)日：2024-02-27
申请号：US17145816
申请日：2021-01-11
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mark Nowell , M. Baris Dogruoz , Mandy Hin Lam , Rakesh Chopra
CPC classification number: H05K7/20236 , G06F1/20 , H01L23/44
Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.
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公开(公告)号：US11650385B2
公开(公告)日：2023-05-16
申请号：US17528415
申请日：2021-11-17
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Paolo Sironi , Giovanni Giobbio , M. Baris Dogruoz
CPC classification number: G02B6/428 , G02B6/4256
Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.
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公开(公告)号：US11647607B2
公开(公告)日：2023-05-09
申请号：US17156085
申请日：2021-01-22
Applicant: CISCO TECHNOLOGY, INC.
Inventor： M. Baris Dogruoz , Mark Nowell , Yi Tang , Rakesh Chopra , Mandy Hin Lam
CPC classification number: H05K7/20236 , H05K1/0203 , H05K1/0272 , H05K7/2089 , H05K7/20627 , H05K7/20636 , H05K2201/064
Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
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公开(公告)号：US11523541B2
公开(公告)日：2022-12-06
申请号：US16928279
申请日：2020-07-14
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Mandy Hin Lam , Mark Nowell , Rakesh Chopra
IPC: H05K7/20 , F28F13/00 , G02B6/42 , H01R13/514
Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.
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40.发明授权公开(公告)号：US11343945B2
公开(公告)日：2022-05-24
申请号：US16697463
申请日：2019-11-27
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Joel Goergen
Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.
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