SAPPHIRE COMPONENT WITH RESIDUAL COMPRESSIVE STRESS
    31.
    发明申请
    SAPPHIRE COMPONENT WITH RESIDUAL COMPRESSIVE STRESS 有权
    具有残余应力的SAPPHIRE组件

    公开(公告)号:US20140193606A1

    公开(公告)日:2014-07-10

    申请号:US13738200

    申请日:2013-01-10

    Applicant: APPLE INC.

    Inventor: Kelvin Kwong

    Abstract: A method comprises shaping an aluminum oxide ceramic material into a component for an electronic device. The component has first and second major surfaces. A selected region of one or both of the first and second major surfaces is heated to an annealing temperature. The selected region is then cooled below the annealing temperature, so that residual compressive stress is generated in the selected region.

    Abstract translation: 一种方法包括将氧化铝陶瓷材料成型为用于电子器件的部件。 该部件具有第一和第二主表面。 将第一和第二主表面中的一个或两个的选定区域加热至退火温度。 然后将选择的区域冷却到退火温度以下,使得在所选择的区域中产生残余的压缩应力。

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