公开(公告)号：US06386079B2

公开(公告)日：2002-05-14

申请号：US09821611

申请日：2001-03-29

Applicant: Timothy L. Hoopman

Inventor： Timothy L. Hoopman

IPC: B23B2900

CPC classification number: B24D11/008 ,  Y10S29/023 ,  Y10S72/703 ,  Y10T82/10 ,  Y10T82/16 ,  Y10T82/16114 ,  Y10T82/16967 ,  Y10T82/2585 ,  Y10T82/2591 ,  Y10T407/28

Abstract: A method and apparatus for knurling a workpiece in which the knurl pattern includes grooves of at least two different configurations. The apparatus includes a knurl wheel holder that allows angular rotation of the knurl wheel about the holder longitudinal axis while maintaining the knurl wheel point of contact on the longitudinal axis. The apparatus also includes a knurling wheel that includes teeth of at least two different configurations. Also disclosed is a method of molding a molded article with the knurled workpiece to impart the inverse of the knurl pattern onto the molded article, such a molded article, a method of forming a structured abrasive article with the molded article, and such an abrasive article.

Abstract translation: 一种用于滚花工件的方法和装置，其中滚花图案包括至少两种不同构型的凹槽。 该设备包括滚花轮保持器，其允许滚花轮围绕保持器纵向轴线的角度旋转，同时保持滚花轮在纵向轴线上的接触点。 该设备还包括滚花轮，其包括至少两种不同构型的齿。 还公开了一种用滚花工件模制成型制品的方法，以将滚花图案的倒数赋予模塑制品，这种模塑制品，用模塑制品形成结构化的磨料制品的方法，以及这种磨料制品 。

公开(公告)号：US06340326B1

公开(公告)日：2002-01-22

申请号：US09493978

申请日：2000-01-28

Applicant: Rod Kistler ,  Yehiel Gotkis

Inventor： Rod Kistler ,  Yehiel Gotkis

IPC: B23B2900

CPC classification number: B24B53/017 ,  B24B37/26 ,  B24B49/04 ,  B24B51/00

Abstract: A system and method for polishing semiconductor wafers includes a rotatable polishing pad movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer. A pad dressing assembly positioned coplanar, and adjacent, to the wafer provides in-situ pad conditioning to a portion of the polishing pad not in contact with the wafer. The method includes the step of radially moving the polishing pad with respect to the wafer.

Abstract translation: 用于抛光半导体晶片的系统和方法包括可移动的抛光垫，其可相对于半导体晶片以多个部分重叠的构造定位。 与晶片共面并相邻设置的衬垫修整组件为不与晶片接触的抛光垫的一部分提供原位衬垫调节。 该方法包括相对于晶片径向移动抛光垫的步骤。

公开(公告)号：US06261032B1

公开(公告)日：2001-07-17

申请号：US08826929

申请日：1997-04-08

Applicant: Jurgen Duwe ,  Rudolf Stricker

Inventor： Jurgen Duwe ,  Rudolf Stricker

IPC: B23B2900

CPC classification number: B23B27/045 ,  B23B2205/02 ,  B23B2260/124 ,  Y10T407/2282 ,  Y10T407/2288 ,  Y10T407/25

Abstract: The invention describes a cutting tool, preferably a cutoff parting tool, having one or more replaceable cutting inserts. The cutting inserts comprises on the supporting and/or clamping surfaces embossed elements. Upon clamping the cutting inserts these elements cause a plastic deformation of the contact surfaces on the toolholder. In this fashion, the cutting inserts are additionally stabilized against lateral compressive forces and tensile forces forcing them out of the seat.

Abstract translation: 本发明描述了一种切割工具，优选地具有一个或多个可更换的切削刀片的切割分离工具。 切削刀片在支撑和/或夹紧表面上包括压花元件。 在夹紧切削刀片时，这些元件会导致刀架上的接触表面发生塑性变形。 以这种方式，切削刀片另外被稳定以防止横向压缩力和拉力迫使它们离开座椅。