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公开(公告)号：US11955731B2
公开(公告)日：2024-04-09
申请号：US17364103
申请日：2021-06-30
Inventor： Yeonwoo Kim , Wonbin Hong , Junho Park , Jaehyun Choi , Sehyun Park , Sumin Yun
CPC classification number: H01Q9/0407 , H01Q5/10 , H04B1/38
Abstract: An electronic device includes a housing including a first plate and a second plate; and a first antenna structure. The first antenna structure includes a board disposed between the first plate and the second plate. The board includes a first surface facing the first plate, a second surface facing the second plate, a plurality of insulating layers stacked on top of each other between the first surface and the second surface, a first conductive layer disposed on the first surface, a second conductive layer disposed on the second surface, a plurality of strips disposed between the plurality of insulating layers, and a plurality of vias connecting at least one or more of the first conductive layer, the second conductive layer, or the plurality of strips to each other and disposed in the plurality of insulating layers. The electronic device further includes a first conductive structure, a second conductive structure, a third conductive structure, and a fourth conductive structure formed as part of the plurality of strips and the plurality of vias; and a wireless communication circuit electrically connected to at least one of the vias and configured to transmit or receive at least one signal having a frequency of 3 GHz to 100 GHz.
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公开(公告)号：US11936115B2
公开(公告)日：2024-03-19
申请号：US17419128
申请日：2019-12-27
Inventor： Yeonwoo Kim , Wonbin Hong , Wonpyo Kwon , Sehyun Park , Sumin Yun
CPC classification number: H01Q21/28 , H01Q1/24 , H01Q9/0407 , H01Q21/0006 , H04B1/40
Abstract: The disclosure provides an electronic device comprising an antenna module and a wireless communication circuit. The antenna module comprises: a printed circuit board comprising a first surface extending in a first direction and a second surface extending in a second direction opposite the first direction; a first area comprising a first antenna array; a second area comprising a second antenna array and at least partially overlapping the first area; a third area comprising a third antenna array and not overlapping the first area; a fourth area comprising a fourth antenna array and at least partially overlapping the third area; and a ground layer. The wireless communication circuit is electrically connected to the plurality of antenna arrays and transmits and/or receives a signal having a frequency in a range of about 3 GHz to 100 GHz.
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公开(公告)号：US11864309B2
公开(公告)日：2024-01-02
申请号：US17440474
申请日：2020-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin Yun , Dongyeon Kim , Seongjin Park , Sehyun Park , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
CPC classification number: H05K1/0237 , H01Q1/243 , H01Q5/328 , H01Q13/02 , H05K1/115 , H05K2201/10098
Abstract: Disclosed is an electronic device comprising: a housing comprising a first plate, a second plate, and a side member, the side member having a first part comprising a first surface, a second surface, a through-hole formed from the first surface to the second surface in a first direction in which same penetrates the side member, and a nonconductive material; a display; a printed circuit board comprising a third surface, a fourth surface, a first conductive layer, a second conductive layer, a feeding line, a conductive pattern, a conductive via, a third conductive layer disposed between the first conductive layer and the second conductive layer, a fourth conductive layer disposed between the first conductive layer and the third conductive layer, multiple first side vias formed so as to electrically connect the first conductive layer and the third conductive layer and to be spaced apart from the conductive via by a first distance in a second direction, which is perpendicular to the first direction, and in which same face away from the through-hole and the slit, and multiple second side vias formed so as to electrically connect the third conductive layer and the fourth conductive layer and to be spaced apart from the conductive via by a second distance, which is different from the first distance, in the second direction; and at least one wireless communication circuit. Various other embodiments recognizable from the specification are also possible.
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Patent Agency Ranking
公开(公告)号：US11757174B2
公开(公告)日：2023-09-12
申请号：US17099615
申请日：2020-11-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Hyuck Lee , Sehyun Park , Jae-Bong Chun
CPC classification number: H01Q1/245 , H01Q1/243 , H01Q9/0407 , H01Q21/062 , H01Q21/065 , H01Q21/067 , H01Q21/28
Abstract: According to various embodiments, an electronic device includes a housing including a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.
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公开(公告)号：US11431109B2
公开(公告)日：2022-08-30
申请号：US16970177
申请日：2019-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin Yun , Sehyun Park , Myunghun Jeong , Jehun Jong , Jaehoon Jo , Jinwoo Jung , Jaebong Chun
Abstract: According to various embodiments, an electronic device may comprise: a housing including a first plate, a second plate oriented in a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate; and, as an antenna structure including at least one plane parallel to the second plate, wherein the antenna structure includes a first element disposed on the plane, a second element spaced apart from the first element on the plane when viewed from above the plane, and a third element spaced apart from the second element on the plane when viewed from above the plane, the second element being disposed between the first element and the third element, a wireless communication circuit electrically configured to transmit and receive a signal having a frequency range of 10 GHz-100 GHz, wherein the wireless communication circuit includes a first electrical path connected to the first element, a second electrical path connected to a first point on the second element, the first point being closer to the first element than to the third element, a third electrical path connected to a second point on the second element, the second point being closer to the third element than to the first element, and a fourth electrical path connected to the third element, and the wireless communication circuit is configured to provide a phase difference between a first signal from the first point and a second signal from the second point. Various other embodiments may also be possible.
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公开(公告)号：US11417954B2
公开(公告)日：2022-08-16
申请号：US17262087
申请日：2019-07-31
Inventor： Yeonwoo Kim , Wonbin Hong , Sehyun Park , Junho Park , Sumin Yun
Abstract: An electronic device according to an embodiment of the present invention may include a housing and an antenna module disposed on one surface of the housing, wherein the antenna module may include a printed circuit board including a first layer facing the one surface of the housing, a second layer facing the first layer, and at least one ground layer disposed between the first layer and the second layer, a first antenna array disposed on the first layer, a second antenna array disposed on the second layer and at least partially overlapping the first antenna array when viewed from the one surface of the housing, and a communication circuit (radio frequency integrated circuit (RFIC)) electrically connected to the first antenna array and the second antenna array and feeding the first antenna array and the second antenna array, wherein the communication circuit may be configured to receive a first signal from an external device via at least one of the first antenna array or the second antenna array, change a phase of at least a portion of the first antenna array and the second antenna array based on the first signal, and transmit/receive a second signal in a direction of a beam formed by the changed phase. Other various embodiments could be derived from the description.
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公开(公告)号：US11202365B2
公开(公告)日：2021-12-14
申请号：US16686687
申请日：2019-11-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon Kim , Seongjin Park , Sehyun Park , Myunghun Jeong , Jehun Jong , Jaehoon Jo , Yoonjung Kim , Gyubok Park
Abstract: An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.
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公开(公告)号：US11171406B2
公开(公告)日：2021-11-09
申请号：US16727484
申请日：2019-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin Yun , Dongyeon Kim , Seongjin Park , Sehyun Park , Myunghun Jeong , Jehun Jong , Jaehoon Jo
Abstract: An electronic device is provided that includes, an antenna structure including a printed circuit board including first and second surfaces, at least one conductive patch interposed between the first second surfaces or is disposed on the first surface, the conductive patch including first to fourth areas placed in a clockwise direction with respect to a first imaginary axis extended in a first direction on the conductive patch and a second imaginary axis intersecting the first imaginary axis and perpendicular to the first imaginary axis, and at least one wireless communication circuit that transmits and/or receives a first signal having a frequency between 3 and 100 GHz. The wireless communication circuit includes a first port electrically connected to a first position of the first area, and a second port electrically connected to a second position placed on an opposite side to the first position with respect to the first imaginary axis.
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