公开(公告)号：US11233050B2

公开(公告)日：2022-01-25

申请号：US16860279

申请日：2020-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geunwoo Kim ,  Yoon Tae Hwang ,  Wandon Kim ,  Hyunbae Lee

IPC: H01L27/088 ,  H01L29/49 ,  H01L23/522 ,  H01L23/528

Abstract: A semiconductor device including a substrate including an active pattern; a gate electrode crossing the active pattern and extending in a first direction; a source/drain pattern on the active pattern and adjacent to a side of the gate electrode; and an active contact in a contact hole on the source/drain pattern, wherein the active contact includes a first contact in a lower region of the contact hole, the first contact including a barrier pattern and a conductive pattern; a diffusion barrier layer on the first contact; and a second contact on the diffusion barrier layer, and a top surface of the diffusion barrier layer is coplanar with a top surface of the barrier pattern of the first contact.

公开(公告)号：US10147616B2

公开(公告)日：2018-12-04

申请号：US14922406

申请日：2015-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soojae Park ,  Geunwoo Kim ,  Keunho Jang ,  Younjo Mun

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L21/50 ,  H01L23/498

Abstract: A package frame includes a plurality of unit regions disposed on one surface of the package frame, a peripheral region surrounding the unit regions on the one surface, and a wrinkled structure disposed on the one surface in the peripheral region. A first surface of the wrinkled structure extends from the one surface and is disposed at a different level than the one surface. Each of the unit regions includes a plurality of conductive pads.