公开(公告)号：US11289462B2

公开(公告)日：2022-03-29

申请号：US16866027

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/13 ,  H01L33/00

Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

公开(公告)号：US11244932B2

公开(公告)日：2022-02-08

申请号：US16675944

申请日：2019-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L25/075 ,  H01L33/62 ,  H01L25/16 ,  H01L23/00 ,  H01L33/48 ,  H01L33/38 ,  H01L33/32 ,  H01L33/06

Abstract: A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.

公开(公告)号：US11222797B2

公开(公告)日：2022-01-11

申请号：US16731468

申请日：2019-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L21/67 ,  H01L33/62 ,  H01L25/075 ,  H01L21/683

Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.

公开(公告)号：US11201202B2

公开(公告)日：2021-12-14

申请号：US16681290

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye Kim ,  Doyoung Kwag ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L27/32

Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

公开(公告)号：US11152245B2

公开(公告)日：2021-10-19

申请号：US16682111

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo Park ,  Doyoung Kwag ,  Eunhye Kim ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L21/683 ,  H01L21/67 ,  H01L33/62

Abstract: A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.

公开(公告)号：US11063026B2

公开(公告)日：2021-07-13

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye Kim ,  Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.

公开(公告)号：US20200335659A1

公开(公告)日：2020-10-22

申请号：US16850645

申请日：2020-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo PARK ,  Minsub Oh ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24

Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.