公开(公告)号：US20110043725A1

公开(公告)日：2011-02-24

申请号：US12546031

申请日：2009-08-24

Applicant: Roger Fratti ,  Kouros Azimi ,  Mohammad Mobin ,  Ian Hughes

Inventor： Roger Fratti ,  Kouros Azimi ,  Mohammad Mobin ,  Ian Hughes

IPC: G02F1/13357 ,  G09F13/04

CPC classification number: G02F1/133603 ,  G02F2001/133607

Abstract: In described embodiments, a thin film transistor (TFT) liquid crystal display (LCD) structure incorporates a white light emitting diode (LED) structure for backlighting. White LEDs are formed behind each TFT cell, allowing for display “black” as a function of a nematic layer, on the TFT substrate, while increasing intensity of the LED LCD backlight structure. A lens structure might be formed between the LEDs and the TFT substrate to reduce a number of LED sources for a given backlight intensity.

Abstract translation: 在所描述的实施例中，薄膜晶体管（TFT）液晶显示器（LCD）结构包括用于背光的白色发光二极管（LED）结构。 白色LED形成在每个TFT单元的后面，允许在TFT基板上显示作为向列层的函数的“黑色”，同时增加LED LCD背光结构的强度。 可以在LED和TFT基板之间形成透镜结构，以减少给定背光强度的LED源的数量。

公开(公告)号：US20070269919A1

公开(公告)日：2007-11-22

申请号：US11832711

申请日：2007-08-02

Applicant: Roger Fratti ,  Joseph Freund

Inventor： Roger Fratti ,  Joseph Freund

IPC: H01L21/02

CPC classification number: H01S5/028 ,  H01L33/0079 ,  H01L33/44 ,  H01S5/4025 ,  H01S5/405

Abstract: A manufacturing method, in which two device bars are bonded prior to facet coating to form a stacked bar pair. In one embodiment, each of the device bars has a p-side and an n-side, each side having a plurality of bonding pads, with at least some bonding pads located at the p-side of the first device bar adapted for mating with the corresponding bonding pads located at the p-side of the second device bar. Solder material deposited onto the p-side bonding pads adapted for mating is liquefied in a reflow oven, wherein surface tension of the liquefied solder self-aligns the device bars with respect to each other and keeps them in alignment until the solder is solidified to form a solder bond between the mated bonding pads. Two or more instances of the bonded bar pair are further stacked such that bonding pads located at the n-sides of adjacent bar pairs are mated in a relatively tight fit. The exposed facets in the resulting stack are then spray-coated with one or more reflective materials, with the solder bonds between the p-side bonding pads and the tight fit between the n-side bonding pads protecting those pads from overspray coating.

Abstract translation: 一种制造方法，其中两个器件棒在小面涂覆之前结合以形成堆叠的棒对。 在一个实施例中，每个设备杆具有p侧和n侧，每侧具有多个接合焊盘，至少一些焊盘位于第一设备杆的p侧，适于与 位于第二装置杆的p侧的对应的焊盘。 沉积在适于配合的p侧接合焊盘上的焊料在回流炉中液化，其中液化焊料的表面张力相对于彼此自动对准器件条并使其保持对准，直到焊料固化形成 在焊接接合焊盘之间的焊接接合。 进一步堆叠两个或更多个粘结棒对的实例，使得位于相邻条形对的n侧的接合焊盘以相对紧密的配合配合。 然后在一个或多个反射材料上喷涂所得到的堆叠中的暴露面，其中p侧焊盘之间的焊料接合，并且n侧焊接焊盘之间的紧密配合保护焊盘免受过度喷涂。

公开(公告)号：US20070153848A1

公开(公告)日：2007-07-05

申请号：US11323758

申请日：2005-12-30

Applicant: Roger Fratti ,  Joseph Freund

Inventor： Roger Fratti ,  Joseph Freund

IPC: H01S3/04

CPC classification number: G11B33/1426 ,  G11B33/1406 ,  H01S5/02212 ,  H01S5/02415 ,  H01S5/0683 ,  H01S5/4025 ,  H01S5/4087

Abstract: An optical assembly comprises a first semiconductor optical device and a second semiconductor optical device. The first and second semiconductor optical devices may, for example, be laser diodes or light-emitting diodes. In addition, the optical assembly includes an active cooling device that is in thermal contact with the first and second semiconductor optical devices. Advantageously, the active cooling device is operative to regulate the temperatures of both the first and second semiconductor optical devices.

Abstract translation: 光学组件包括第一半导体光学器件和第二半导体光学器件。 第一和第二半导体光学器件可以例如是激光二极管或发光二极管。 此外，光学组件包括与第一和第二半导体光学器件热接触的主动冷却装置。 有利地，主动冷却装置可操作以调节第一和第二半导体光学装置两者的温度。

公开(公告)号：US20070073848A1

公开(公告)日：2007-03-29

申请号：US11237994

申请日：2005-09-28

Applicant: Roger Fratti

Inventor： Roger Fratti

IPC: G06F15/177

CPC classification number: G06Q10/107

Abstract: A communication method providing audio notification that can indicate to the recipient the relative importance of a particular email message. In one embodiment, a communication method of the invention enables the sender of an email message to provide for the message an audio tag that specifies a notification sound that can be produced at the recipient's email-enabled device, e.g., instead of a default notification sound. In another embodiment, the recipient's device is configured to produce a notification sound based on at least one of (i) priority level of the email message and (ii) the audio tag provided with the message. Embodiments of the invention enhance the recipient's ability to screen email messages without looking at the message content, which can advantageously reduce occurrences of unnecessary toggling between email and other user applications, thereby improving the recipient's productivity.

Abstract translation: 提供音频通知的通信方法，其可以向接收者指示特定电子邮件消息的相对重要性。 在一个实施例中，本发明的通信方法使得电子邮件消息的发送者能够向消息提供指定可以在接收者的启用电子邮件的设备上产生的通知声音的音频标签，例如代替默认通知声音 。 在另一个实施例中，接收者的设备被配置为基于（i）电子邮件消息的优先级和（ii）提供有消息的音频标签中的至少一个来产生通知声音。 本发明的实施例增强了接收者在不查看消息内容的情况下屏蔽电子邮件的能力，其可以有利地减少电子邮件和其他用户应用之间不必要的切换的发生，从而提高接收者的生产力。

公开(公告)号：US20070046435A1

公开(公告)日：2007-03-01

申请号：US11214262

申请日：2005-08-29

Applicant: Roger Fratti ,  Warren Waskiewicz

Inventor： Roger Fratti ,  Warren Waskiewicz

IPC: H04Q5/22

CPC classification number: G06K7/0008 ,  G06K7/10019

Abstract: RFID tags include circuitry operable to receive an input signal from a common transceiver and generate at least first and second signals, a first signal adapted to transmit information to the common transceiver and a second signal adapted to transmit information to adjacent RFID tags. The second adapted signal is received by the adjacent RFID tags and used to control their operation wherein they are temporarily disabled. During the time that the adjacent RFID tags are disabled, the first RFID tag communicates with the common transceiver via the first signal. When communication is complete the first RFID tags temporarily disable themselves allowing the adjacent RFID tags to be enabled and communicate with the common transceiver. In this manner only limited numbers of RFID tags are transmitting at one time thereby limiting the amount of RF power impinging upon the common transceiver. Spreading the RF power received by the common transceiver over time reduces the probability that the common transceiver will be overloaded or saturated improving the data transmission between RFID tags and common transceiver.

Abstract translation: RFID标签包括可操作以从公共收发器接收输入信号并产生至少第一和第二信号的电路，适于向公共收发器发送信息的第一信号和适于向相邻RFID标签发送信息的第二信号。 第二适配信号由相邻RFID标签接收并用于控制它们的操作，其中它们被暂时禁用。 在相邻RFID标签被禁用的时间内，第一RFID标签经由第一信号与公共收发器通信。 当通信完成时，第一RFID标签临时禁用自身，允许相邻RFID标签被启用并与公共收发器通信。 以这种方式，只有有限数量的RFID标签一次发送，从而限制了冲击在公共收发器上的RF功率的量。 普通收发器随时间传播RF功率可以降低普通收发器过载或饱和的可能性，从而改善RFID标签与公共收发器之间的数据传输。

公开(公告)号：US20060091480A1

公开(公告)日：2006-05-04

申请号：US10981175

申请日：2004-11-03

Applicant: John Desko ,  Roger Fratti ,  Vivian Ryan

Inventor： John Desko ,  Roger Fratti ,  Vivian Ryan

IPC: H01L23/62

CPC classification number: H01L29/7835 ,  H01L23/4824 ,  H01L29/402 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/41775 ,  H01L29/4238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The specification describes an improved mechanical electrode structure for MOS transistor devices with elongated runners. It recognizes that shrinking the geometry increases the likelihood of mechanical failure of comb electrode geometries. The mechanical integrity of a comb electrode is improved by interconnecting the electrode fingers in a cross-connected grid. In one embodiment, the transistor device is interconnected with gate fingers on a lower metaliization level, typically the first level metal, with the drain interconnected at a higher metal level. That allows the drain fingers to be cross-connected with a vertical separation between drain and gate comb electrodes. The cross-connect members may be further stabilized by adding beam extensions to the cross-connect members. The beam extensions may be anchored in an interlevel dielectric layer for additional support.

公开(公告)号：US20060076676A1

公开(公告)日：2006-04-13

申请号：US10960680

申请日：2004-10-07

Applicant: Roger Fratti

Inventor： Roger Fratti

IPC: H01L23/34

CPC classification number: H01L25/0657 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A multi-chip electronic module comprises a multiplicity of integrated circuit chips arranged in a vertical stack. Each chip includes at least one first electrical terminal, with at least a first subset of the first terminals being disposed at different heights relative to the stack. A multiplicity of second electrical terminals is disposed on a support member, and a multiplicity of first electrical conductors (e.g., wirebonds) is connected between the first subset and at least a second subset of the second terminals. In order to reduce the skew produced at relatively high frequencies, all of the first conductors have substantially the same inductive impedance at the frequency of operation of the module. Our invention is particularly well suited to modules that operate at frequencies of about 500 MHz or higher.

Abstract translation: 多芯片电子模块包括以垂直叠层布置的多个集成电路芯片。 每个芯片包括至少一个第一电端子，其中第一端子的至少第一子集相对于堆叠设置在不同的高度。 多个第二电端子设置在支撑构件上，并且多个第一电导体（例如引线键）连接在第一子集与第二终端的至少第二子集之间。 为了减少在较高频率下产生的偏斜，所有的第一导体在模块的工作频率下具有基本上相同的电感阻抗。 我们的发明特别适用于在大约500MHz或更高频率下工作的模块。