公开(公告)号：US20160240455A1

公开(公告)日：2016-08-18

申请号：US14625452

申请日：2015-02-18

Applicant: QUALCOMM Incorporated

Inventor： Sun YUN ,  Rajneesh KUMAR ,  Houssam Wafic JOMAA ,  Joan Rey V. BUOT

IPC: H01L23/367 ,  H01L23/528 ,  H01L25/07 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/072 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: Some examples of the disclosure include a semiconductor package having a heat spreader, an outer perimeter portion attached to the bottom of the heat spreader along the perimeter and having a plurality of electrical pathways, a package substrate located below and spaced from the outer perimeter portion and having a plurality of electrical pathways, a plurality of connection points located between the outer perimeter component and the package substrate to provide connection points coupling the plurality of electrical pathways of the outer perimeter portion to the plurality of electrical pathways in the package substrate, and a cavity formed on the bottom of the heat spreader inside the outer perimeter portion.

Abstract translation: 本公开的一些示例包括具有散热器的半导体封装，沿着周边附接到散热器底部并具有多个电路径的外周边部分，位于外周部分下方并与外周部分隔开的封装基板， 具有多个电路径，多个连接点，位于所述外周边部件和所述封装衬底之间，以提供连接点，所述连接点将所述外周边部分的所述多个电通路连接到所述封装衬底中的所述多个电路径，以及 在外周部分内的散热器底部形成的空腔。