公开(公告)号：US06252220B1

公开(公告)日：2001-06-26

申请号：US09299122

申请日：1999-04-26

Applicant: Josef E. Jedlicka ,  Debra S. Vent

Inventor： Josef E. Jedlicka ,  Debra S. Vent

IPC: H01L2700

CPC classification number: H01L27/1462 ,  H01L27/14632 ,  H01L27/14687

Abstract: The present invention relates to a sensor cover glass for covering photosensitive chips for generating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other digital imaging device or system. More specifically, the present invention relates to providing a sensor cover glass with an infrared filter material for blocking infrared light from reaching the photosensitive chips. This system is particularly applicable to color input imaging devices or systems.

Abstract translation: 本发明涉及用于覆盖用于从原始图像产生电信号的感光芯片的传感器盖玻璃，例如可以在数字扫描仪，复印机，传真机或其他数字成像设备或系统中找到。 更具体地说，本发明涉及提供具有用于阻挡红外光到达感光芯片的红外滤光材料的传感器盖玻璃。 该系统特别适用于彩色输入成像设备或系统。

公开(公告)号：US4814296A

公开(公告)日：1989-03-21

申请号：US90827

申请日：1987-08-28

Applicant: Josef E. Jedlicka ,  Kimberly R. Page ,  Alain E. Perregaux ,  Fred F. Wilczak, Jr.

Inventor： Josef E. Jedlicka ,  Kimberly R. Page ,  Alain E. Perregaux ,  Fred F. Wilczak, Jr.

IPC: B28D5/00 ,  B27G19/10 ,  F28D5/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/306 ,  H01L27/148

CPC classification number: B27G19/10 ,  H01L21/3043 ,  Y10S148/028

Abstract: A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.

公开(公告)号：US4641949A

公开(公告)日：1987-02-10

申请号：US769515

申请日：1985-08-26

Applicant: Stanley J. Wallace ,  Josef E. Jedlicka ,  Wilbur M. Peck, Jr.

Inventor： Stanley J. Wallace ,  Josef E. Jedlicka ,  Wilbur M. Peck, Jr.

IPC: G03B27/62 ,  B65H7/02 ,  B65H7/14 ,  B65H43/02 ,  G03G15/00 ,  G03G15/04

CPC classification number: G03G15/65 ,  B65H43/02 ,  G03G2215/00371 ,  G03G2215/00611 ,  G03G2215/00632 ,  G03G2215/00734

Abstract: The present invention is concerned with a switching element comprised of oppositely disposed conductive fiber brushes and/or brush-like elements for detecting the presence or absence of paper at various locations in a xerographic copy machine. The oppositely disposed brushes are made from poly-acrylo-nitrile, a carbon based polymer material, which can be fabricated with relatively low values of resistance. Typical fiber bundles may consist of 6000 individual fibers each of 6-10 microns in diameter. In operation each individual conductive fiber acts as a separate electrical path through which the external circuit is completed. Passage of paper through the "nip" of the fiber to fiber electrical contact opens the circuit which is easily detected through associated circuitry which indicates the presence of paper. Likewise, arrays incorporating multiple such sensor switches may be fabricated for the purpose of indicating the size of the document interrupting specific low resistance fiber-fiber switches.

Abstract translation: 本发明涉及由相对设置的导电纤维刷和/或刷状元件组成的开关元件，用于在静电复印机中的各个位置检测是否存在纸。 相对布置的刷子由聚丙烯腈（碳 - 丙烯腈）制成，其可以制造成具有相对较低的电阻值。 典型的纤维束可以由直径为6-10微米的6000个单独纤维组成。 在操作中，每个单独的导电纤维作为外部电路完成的单独的电路径。 将纸通过纤维的“咬合”到纤维电接触，打开电路，通过指示纸张存在的相关电路容易地检测。 同样，可以制造并入多个这样的传感器开关的阵列，用于指示中断特定的低电阻光纤开关的文件尺寸。

公开(公告)号：US06955989B2

公开(公告)日：2005-10-18

申请号：US09996681

申请日：2001-11-30

Applicant: Alain E. Perregaux ,  Paul A. Hosier ,  Josef E. Jedlicka ,  Nicholas J. Salatino ,  Jagdish C. Tandon

Inventor： Alain E. Perregaux ,  Paul A. Hosier ,  Josef E. Jedlicka ,  Nicholas J. Salatino ,  Jagdish C. Tandon

IPC: B28D5/02 ,  H01L21/301 ,  H01L21/3065 ,  H01L21/302

CPC classification number: B28D5/022 ,  H01L21/78

Abstract: The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.

Abstract translation: 本公开内容涉及通过将第二蚀刻步骤通过将第二蚀刻步骤修改为干蚀刻而不是湿蚀刻将芯片芯片切割方法修改为U形沟槽轮廓导致通过消除更昂贵的直接成本节省 工艺步骤，以及剥离显影的光致抗蚀剂层的需要。 此外，进入U形凹槽轮廓可实现额外的间接和更大的成本节省，这是由于加工量增加，产量提高和金属层缺陷减少。

公开(公告)号：US06768565B1

公开(公告)日：2004-07-27

申请号：US09657342

申请日：2000-09-07

Applicant: Alain E. Perregaux ,  Josef E. Jedlicka

Inventor： Alain E. Perregaux ,  Josef E. Jedlicka

IPC: H01L2700

CPC classification number: H04N1/031 ,  H01L27/14621 ,  H04N2201/02493

Abstract: The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.

Abstract translation: 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。

公开(公告)号：US5119181A

公开(公告)日：1992-06-02

申请号：US681809

申请日：1991-04-08

Applicant: Alain E. Perregaux ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Stephen C. Corona

Inventor： Alain E. Perregaux ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Stephen C. Corona

IPC: H04N1/48

CPC classification number: H04N1/486

Abstract: A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.

Abstract translation: 特别适用于制造全宽阵列的彩色芯片结构，其中由蓝色，绿色和红色光电二极管组成的单个芯片光电二极管形成并定位成提供具有方形侧面的矩形光泽，以增强与其他类似物的颜色芯片对接 彩色芯片组成全彩色阵列。

公开(公告)号：US5031032A

公开(公告)日：1991-07-09

申请号：US501584

申请日：1990-03-30

Applicant: Alain E. Perregaux ,  Jagdish C. Tandon ,  Josef E. Jedlicka

Inventor： Alain E. Perregaux ,  Jagdish C. Tandon ,  Josef E. Jedlicka

IPC: H01L31/02 ,  H04N1/028 ,  H04N1/48

CPC classification number: H04N1/486

Abstract: A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.