摘要:
An organic light-emitting device includes a first substrate, a light-emitting structure layer, a first electrode layer, a second electrode layer, a second substrate, first conduction members, a second conduction member and protection structures. The light-emitting structure layer is disposed on the first substrate. The first electrode layer is disposed on the light-emitting structure layer and includes pad-like patterns. The second electrode layer is disposed between the light-emitting structure layer and the first substrate. The second substrate is adhered on the first electrode layer and includes a first circuit and a second circuit. The first circuit includes a continuous pattern and contact portions. The first conduction members are connected between the first circuit and the first electrode layer. The second conduction member is connected between the second circuit and the second electrode layer. The protection structures respectively form open circuits or close circuits between the contact portions and the continuous pattern.
摘要:
An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.
摘要:
A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.