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公开(公告)号:US06368931B1
公开(公告)日:2002-04-09
申请号:US09536860
申请日:2000-03-27
申请人: Kelin J. Kuhn , Ian R. Post
发明人: Kelin J. Kuhn , Ian R. Post
IPC分类号: H01L21331
CPC分类号: H01L21/3144 , H01L21/76232
摘要: The present invention relates to a method of forming an isolation trench that comprises forming a recess in a substrate and forming a film upon the sidewall under conditions that cause the film to have a tensile load. The method includes filling the recess with a material that imparts a compressive load upon the film under conditions that oppose the tensile load. The present invention is particularly well suited for shallow isolation trench filling in the 0.13 micron geometry range, and smaller.