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公开(公告)号:US10333374B2
公开(公告)日:2019-06-25
申请号:US15589422
申请日:2017-05-08
Applicant: General Electric Company
Inventor: Jeffrey Stuart Sullivan , Christopher Michael Calebrese , Qin Chen , Alexander Rene Anderton , Massimiliano Vezzoli
Abstract: Insulation systems that present an electrical stress grading through the disposition of resistively graded networks between insulating layers is described. The resistively graded networks may be implemented by coating insulating material with resistive material, and wrapping the insulation material around a conductor. The resistive material may be linear or non-linear material. Fabrication of the insulating material, the resistive material, and the coating process are also discussed, as well as the application of the insulation to the conductor are also discussed.
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公开(公告)号:US10236113B2
公开(公告)日:2019-03-19
申请号:US15483679
申请日:2017-04-10
Applicant: General Electric Company
Inventor: Alan Carroll Lovell , Mark Eugene Shepard , Andrew David McArthur , Qin Chen , Todd David Greenleaf
IPC: H01F27/36 , H01F27/32 , H01F5/00 , H01F27/28 , H05K1/02 , H05K1/16 , H05K1/14 , H05K3/46 , H01F27/24 , H01F41/04 , H01F41/02
Abstract: A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.
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公开(公告)号:US20180197669A1
公开(公告)日:2018-07-12
申请号:US15402962
申请日:2017-01-10
Applicant: General Electric Company
Inventor: Philip Michael Cioffi , Qin Chen , Wei Zhang , Ravisekhar Nadimpalli Raju
CPC classification number: H01F27/02 , H01F27/24 , H01F27/266 , H01F27/2804 , H01F27/2823 , H01F27/2847 , H01F27/29 , H01F27/306 , H01F27/32 , H01F27/324 , H01F41/0206 , H01F41/061 , H01F41/125 , H01F2027/2809 , H01F2027/2819
Abstract: A transformer includes a ceramic housing, a primary winding disposed within the housing, a secondary winding disposed outside the winding, and a core extending through a first aperture in the housing. The housing includes a first portion and a second portion. Each of the first and second portions include a planar structure having a first housing aperture, and a plurality of sidewalls extending perpendicular to the planar structure along a plurality of edges of the planar structure. The first and second portions interface with one another when the ceramic housing is assembled such that the sidewalls of the first and second portions overlap with one another.
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公开(公告)号:US20180115011A1
公开(公告)日:2018-04-26
申请号:US15331421
申请日:2016-10-21
Applicant: General Electric Company
Inventor: Keith Garrette Brown , Liwei Hao , Darren Bawden Hickey , Kevin Joseph Gavel , John Raymond Krahn , Qin Chen , Lili Zhang , Daniel Qi Tan
IPC: H01M8/2485 , H01M8/0662
CPC classification number: H01M8/2485 , F16L25/0072 , F16L25/026 , F16L55/24 , H01M8/0662 , H01M2008/1293 , H01M2250/10 , Y02B90/14 , Y02E60/525
Abstract: A flange assembly for use with a SOFC system includes a first flange, a second flange, and a dielectric element coupled between the first flange and the second flange. The dielectric element includes an outer cylindrical surface and an inner cylindrical surface. The inner cylindrical surface defines a cylindrical region having a circumference. The inner cylindrical surface also defines a channel that extends radially about the circumference of the cylindrical region.
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公开(公告)号:US09620278B2
公开(公告)日:2017-04-11
申请号:US14184632
申请日:2014-02-19
Applicant: General Electric Company
Inventor: Alan Carroll Lovell , Mark Eugene Shepard , Andrew David McArthur , Qin Chen , Todd David Greenleaf
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/24 , H01F27/2885 , H01F41/0206 , H01F41/043 , H01F41/32 , H01F2017/008 , H01F2027/2809 , H01F2027/2819 , H05K1/0224 , H05K1/0254 , H05K1/0256 , H05K1/144 , H05K1/165 , H05K3/46 , H05K2201/0715 , H05K2201/09672 , H05K2201/098 , Y10T29/4902 , Y10T29/49073
Abstract: A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.
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公开(公告)号:US20150171566A1
公开(公告)日:2015-06-18
申请号:US14105205
申请日:2013-12-13
Applicant: General Electric Company
Inventor: Qin Chen , Weijun Yin , Lili Zhang
IPC: H01R13/66 , H01R13/6581
CPC classification number: H01R13/6616 , E21B33/0385 , H01R13/523 , H01R13/6581 , H01R13/6592 , H01R13/665 , H02G15/103
Abstract: An electrical connector is presented. The electrical connector includes a first cable termination chamber configured to receive a first power cable comprising at least a first conductor sheathed at least in part by a first insulating layer and a first insulation screen layer. Also, the electrical connector includes a first non-linear resistive layer configured to be coupled to a portion of the first conductor unsheathed by at least the first insulation screen layer and configured to control a direct current electric field generated in the first cable termination chamber. In addition, the electrical connector includes a first deflector configured to be coupled to the first power cable and control an alternating current electric field generated in the first cable termination chamber.
Abstract translation: 提供电连接器。 电连接器包括第一电缆终端室,其被配置为接收包括至少部分地由第一绝缘层和第一绝缘屏蔽层护套的至少第一导体的第一电力电缆。 此外,电连接器包括第一非线性电阻层,其被配置为耦合到至少第一绝缘屏蔽层未被封装的第一导体的一部分,并被配置为控制在第一电缆终端室中产生的直流电场。 另外,电连接器包括被配置为联接到第一电力电缆并且控制在第一电缆终端室中产生的交流电场的第一偏转器。
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