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公开(公告)号：US20240284702A1
公开(公告)日：2024-08-22
申请号：US18025062
申请日：2022-05-31
Inventor： Yongkai WU , Zhengping XIONG , Yunzhi WANG , Haoyuan FAN , Bo ZHANG , Jinyu CHAO , Shuaimin JIAN , Yixiang YANG , Gaoyun WANG , Chao LIU
IPC: H10K50/842 , H10K59/40 , H10K59/80 , H10K102/00
CPC classification number: H10K50/8423 , H10K59/40 , H10K59/873 , H10K2102/311
Abstract: Provides are a display panel, a display module, and a display device. The display panel includes an opening region, a barrier region surrounding the opening region, a display region surrounding the barrier region, a base substrate, a crack blocking structure surrounding the opening region; a barrier wall surrounding the crack blocking structure. The barrier wall and the crack blocking structure include a first metal layer and a first organic layer, an edge of side of the first metal layer away from the base substrate is indented relative to an edge of side of the first organic layer proximal to the base substrate. The barrier wall and the crack blocking structure includes a deep groove penetrating through a film layer between the first organic layer and the base substrate, the deep groove surrounds the opening region. The first organic layer fills the deep groove and is connected to the base substrate.
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公开(公告)号：US20210296394A1
公开(公告)日：2021-09-23
申请号：US17264036
申请日：2020-06-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke MENG , Qiangwei CUI , Chao LIU , Lili WANG , Chuhang WANG , Yutian CHU , Linhui GONG
Abstract: An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US20210167045A1
公开(公告)日：2021-06-03
申请号：US16862934
申请日：2020-04-30
Inventor： Ke MENG , Chao LIU , Qiangwei CUI , Chuhang WANG , Lili WANG , Linhui GONG , Yutian CHU , Fan YANG
IPC: H01L25/075 , H01L27/12 , H01L33/62
Abstract: A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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24.发明公开公开(公告)号：US20230207733A1
公开(公告)日：2023-06-29
申请号：US17926791
申请日：2021-08-06
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Linhui GONG , Chao LIU , Haiwei SUN , Chuhang WANG , Lili WANG , Chaoyang WANG , Xue DONG
CPC classification number: H01L33/382 , H01L25/0753 , H01L33/62 , H01L33/005 , G09F9/3026 , G09F9/33 , H01L2933/0016 , H01L2933/0066
Abstract: A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is range in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.
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公开(公告)号：US20210159208A1
公开(公告)日：2021-05-27
申请号：US16830834
申请日：2020-03-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Lili WANG , Haiwei SUN , Zhenxing TANG , Feng QU , Jing LIU , Chao LIU , Chuhang WANG , Qiangwei CUI , Ke MENG , Linhui GONG
Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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Patent Agency Ranking
公开(公告)号：US20190293995A1
公开(公告)日：2019-09-26
申请号：US16316909
申请日：2018-05-14
Inventor： Xiongzhou WEI , Min LI , Qiang XIONG , Chao LIU , Jiaqi PANG , Bin WAN , Hongyu SUN
IPC: G02F1/1335
Abstract: A color filter (CF) substrate, a manufacturing method thereof and a display panel are provided. The manufacturing method of the substrate includes: providing a base substrate; and forming a black matrix layer and a plurality of first sub-pixel units on the base substrate, wherein the black matrix layer and the plurality of first sub-pixel units are made of photoresist of a same material, the material of the photoresist includes an irreversible thermochromic pigment, the photoresist is changed into black color upon being heated, and a color of the photoresist before color change is the same as a color of the first sub-pixel units.
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公开(公告)号：US20250056980A1
公开(公告)日：2025-02-13
申请号：US18291237
申请日：2022-09-21
Inventor： Yongkai WU , Bo ZHANG , Zhengping XIONG , Yunzhi WANG , Haoyuan FAN , Jinyu CHAO , Yixiang YANG , Gaoyun WANG , Chao LIU
IPC: H10K59/126 , H10K59/131 , H10K59/80
Abstract: The display panel comprises a display region and a bonding region, the bonding region comprises a display substrate and a first adhesive layer, a polarizing layer, a second adhesive layer and a cover plate layer arranged sequentially on a light exit side of the display substrate, the first adhesive layer and the polarizing layer are disposed in a lead region, a bending region and a composite circuit region in the bonding region, the cover plate layer is provided with a cover plate shield layer, at least one of the display substrate, the first adhesive layer and the polarizing layer is provided with a bonding shield layer, the distance between an edge of the bonding shield layer and the boundary of the display region is less than the distance between an edge of the cover plate shield layer and the boundary of the display region.
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公开(公告)号：US20210193687A1
公开(公告)日：2021-06-24
申请号：US17040510
申请日：2020-03-18
Inventor： Yonglian QI , Chao LIU , Lianjie QU , Hebin ZHAO , Shan ZHANG , Ning JIA , Guangdong SHI , Shuai LIU
IPC: H01L27/12 , H01L25/075
Abstract: A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.
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公开(公告)号：US20200043948A1
公开(公告)日：2020-02-06
申请号：US16400607
申请日：2019-05-01
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chao LIU , Yujun ZHANG , Jing YU , Julong FENG
IPC: H01L27/12 , G02F1/1362
Abstract: An array substrate, a display panel and a manufacturing method thereof are provided. The array substrate includes a base substrate including a peripheral region; and a lead region located in the peripheral region, the lead region including a plurality of leads, wherein a main plane of the base substrate provided with the plurality of leads includes a first side edge, and the plurality of leads extend to the first side edge, a lateral surface of the base substrate at the first side edge is provided with a concave portion, and an electrode electrically connected with the plurality of leads is disposed in the concave portion.
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公开(公告)号：US20190101783A1
公开(公告)日：2019-04-04
申请号：US15995659
申请日：2018-06-01
Inventor： Ruilin BI , Qiang XIONG , Kui ZHANG , Xiongzhou WEI , Chao LIU
IPC: G02F1/1333 , G02F1/1339
Abstract: A curved display panel includes a first substrate and a second substrate cell-assembled to each other, a spacer layer disposed between the first substrate and the second substrate and configured to support the first substrate and the second substrate so as to form a gap, and a liquid crystal layer disposed in the gap, wherein the spacer layer includes a plurality of spacer groups, each of the plurality of spacer groups includes a first spacer provided on the first substrate and a second spacer provided on the second substrate, the plurality of spacer groups have supporting area on the first substrate as same as supporting area on the second substrate. A curved display device is further provided.
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