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29 条记录 (耗时 0.046 秒)

    Display system and rigid flex PCB with flip chip bonded inside cavity
    22.
    发明授权
    Display system and rigid flex PCB with flip chip bonded inside cavity 有权

    公开(公告)号：US11129284B2

    公开(公告)日：2021-09-21

    申请号：US16912522

    申请日：2020-06-25

    申请人： Apple Inc.

    发明人： Adam Adjiwibawa ,  Shaowei Qin ,  Victor H. Yin ,  Wenyong Zhu ,  Steven M. Scardato

    IPC分类号： H05K1/00 ,  H05K3/46

    摘要： A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.

    Electronic devices with backlit displays
    23.
    发明授权
    Electronic devices with backlit displays 有权

    公开(公告)号：US10571743B2

    公开(公告)日：2020-02-25

    申请号：US15688736

    申请日：2017-08-28

    申请人： Apple Inc.

    发明人： Byungsoo Ko ,  Daming Xu ,  Heesang Suh ,  Michael Tom ,  Shin-Ying Lu ,  Thomas Mueller ,  Wenyong Zhu ,  Victor H. Yin ,  Mookyung Son

    IPC分类号： G02F1/1335 ,  F21V8/00

    摘要： A display may have a backlight unit that provides backlight illumination. The backlight unit may include a light guide that distributes light through the display. Light-emitting diodes may emit light into the light guide. A reflector that is overlapped by the light guide may help reflect light upwards through an array of pixels. The backlight unit may have a chassis that receives the reflector, light guide, light-emitting diodes, and optical films such as diffusers and prism films. Optical and mechanical features in the backlight unit may enhance color and intensity uniformity for the backlight illumination and may help enhance durability.

    Electronic device having display with thin-film encapsulation
    24.
    发明授权
    Electronic device having display with thin-film encapsulation 有权

    公开(公告)号：US10483493B2

    公开(公告)日：2019-11-19

    申请号：US15864983

    申请日：2018-01-08

    申请人： Apple Inc.

    发明人： Daniel B. Sargent ,  John Raff ,  Li Zhang ,  Victor H. Yin ,  Wenyong Zhu

    IPC分类号： H01L51/52 ,  H01L23/29 ,  H01L49/02 ,  H01L27/32 ,  H01L51/00 ,  G06F1/16 ,  H04N1/00 ,  H05K1/02

    摘要： An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.

    Light-Emitting Diodes in Displays with Direct-lit Backlight Units
    26.
    发明申请
    Light-Emitting Diodes in Displays with Direct-lit Backlight Units 审中-公开

    公开(公告)号：US20190285942A1

    公开(公告)日：2019-09-19

    申请号：US16294727

    申请日：2019-03-06

    申请人： Apple Inc.

    发明人： Rong Liu ,  Edward H Kang ,  Jun Qi ,  Mookyung Son ,  Pee Khaim So ,  Victor H. Yin ,  Wei Lv ,  Wenyong Zhu ,  Zhenyue Luo ,  Xinyu Zhu ,  Ling Han ,  Hung Sheng Lin

    IPC分类号： G02F1/1335 ,  H05K1/18 ,  H05K1/02 ,  H05K3/22 ,  H05K3/34

    摘要： A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a backlight unit. The backlight unit may include a printed circuit board, a plurality of light-emitting diodes mounted on the printed circuit board, at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes, a partially reflective layer formed over the at least one light spreading layer, a color conversion layer formed over the partially reflective layer, a collimating layer formed over the color conversion layer, a brightness enhancement film formed over the collimating layer, and a diffuser formed over the brightness enhancement film. The at least one light spreading layer may include two light spreading layers with elongated protrusions that are rotated relative to each other.

    Electronic Device Having Display With Thin-Film Encapsulation
    27.
    发明申请
    Electronic Device Having Display With Thin-Film Encapsulation 审中-公开

    公开(公告)号：US20190044093A1

    公开(公告)日：2019-02-07

    申请号：US15864983

    申请日：2018-01-08

    申请人： Apple Inc.

    发明人： Daniel B. Sargent ,  John Raff ,  Li Zhang ,  Victor H. Yin ,  Wenyong Zhu

    IPC分类号： H01L51/52 ,  H01L27/32 ,  H01L23/29 ,  H01L49/02

    摘要： An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.

    Backlight Structures and Backlight Assemblies for Electronic Device Displays
    29.
    发明申请
    Backlight Structures and Backlight Assemblies for Electronic Device Displays 审中-公开
    电子设备显示器的背光结构和背光组件

    公开(公告)号：US20140211505A1

    公开(公告)日：2014-07-31

    申请号：US14245447

    申请日：2014-04-04

    申请人： Apple Inc.

    发明人： Jeremy C. Franklin ,  Derek W. Wright ,  Wenyong Zhu

    IPC分类号： F21V8/00 ,  H05K1/18

    CPC分类号： G06Q20/204 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0088 ,  G02B6/0091 ,  G06Q20/3223 ,  H05K1/189

    摘要： An electronic device may have a liquid crystal display with backlight structures. The backlight structures may produce backlight that passes through the display layers in the display. The display layers may include a layer of liquid crystal material interposed between a color filter layer and a thin-film transistor layer. The backlight structures may include a light guide plate. A plurality of light-emitting diodes mounted on a flexible printed circuit may be coupled to an edge of the light guide plate. The flexible printed circuit may be curled into a spring element to bias the light-emitting diodes against the edge of the light guide plate. A plurality of gaps may be formed in the flexible printed circuit and may be used to separate and mechanically decouple adjacent light-emitting diodes. Individual light-emitting diodes may independently register to the light guide plate to maximize optical efficiency in the display.

    摘要翻译： 电子设备可以具有带背光结构的液晶显示器。 背光结构可以产生穿过显示器中的显示层的背光。 显示层可以包括介于滤色器层和薄膜晶体管层之间的液晶材料层。 背光结构可以包括导光板。 安装在柔性印刷电路上的多个发光二极管可以耦合到导光板的边缘。 柔性印刷电路可以卷曲成弹簧元件，以将发光二极管偏压抵靠导光板的边缘。 可以在柔性印刷电路中形成多个间隙，并且可以用于分离和机械地分离相邻的发光二极管。 单独的发光二极管可以独立地对准导光板以使显示器的光学效率最大化。