公开(公告)号：US12288780B2

公开(公告)日：2025-04-29

申请号：US17824194

申请日：2022-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju-Youn Choi ,  Kyoung Lim Suk ,  Wonjae Lee

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/48 ,  H01L23/538 ,  H01L23/552

Abstract: A semiconductor package including: a package substrate; an interposer on the package substrate; a chip stack on the interposer, the chip stack including a plurality of first semiconductor chips that are stacked in a first direction; a second semiconductor chip on the interposer and spaced apart from the chip stack in a second direction intersecting the first direction; and a first signal pad, a second signal pad, and a power/ground pad on a top surface of the interposer, wherein the chip stack is mounted on the first signal pad, wherein the second semiconductor chip is mounted on the second signal pad, wherein the chip stack and the second semiconductor chip are connected to the power/ground pad, and wherein the power/ground pad overlaps a portion of the chip stack and a portion of the second semiconductor chip.

公开(公告)号：US12288745B2

公开(公告)日：2025-04-29

申请号：US17844815

申请日：2022-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donguk Kwon ,  Wooram Myung ,  Jiwon Shin ,  Pilsung Choi

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  H01L25/10

Abstract: A semiconductor package includes a lower substrate having a chip mounting region, an interconnection region surrounding the chip mounting region, and an outer region surrounding the interconnection region, and includes a lower wiring layer. A first solder resist pattern has first openings exposing bonding regions of the lower wiring layer. A semiconductor chip is on the chip mounting region and is electrically connected to the lower wiring layer. A second solder resist pattern is on the first solder resist pattern on the interconnection and outer regions and is spaced apart from the semiconductor chip, and includes second openings disposed on the first openings. An upper substrate covers the semiconductor chip, and includes an upper wiring layer. A vertical connection structure is on the interconnection region and electrically connects the upper and lower wiring layers. A solder resist spacer is on the second solder resist pattern on the outer region.

公开(公告)号：US12288738B2

公开(公告)日：2025-04-29

申请号：US17227850

申请日：2021-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghwan Park ,  Jongseob Kim ,  Jaejoon Oh ,  Soogine Chong ,  Sunkyu Hwang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L29/20

Abstract: Provided are a semiconductor device package and/or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of the semiconductor device, a lead frame including a plurality of conductive members bonded to the plurality of electrode pads, and a mold between the plurality of conductive members.

公开(公告)号：US12288734B2

公开(公告)日：2025-04-29

申请号：US17714202

申请日：2022-04-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juik Lee ,  Jong-Min Lee ,  Jimin Choi ,  Yeonjin Lee ,  Jeon Il Lee

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L23/528 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor device includes a substrate including a first side and a second side opposite to each other, a first penetrating structure that penetrates the substrate, and a second penetrating structure that penetrates the substrate, the second penetrating structure being spaced apart from the first penetrating structure, and an area of the first penetrating structure being more than twice an area of the second penetrating structure, as viewed from the first side of the substrate.

公开(公告)号：US12288486B2

公开(公告)日：2025-04-29

申请号：US18074005

申请日：2022-12-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jookwan Lee ,  Yongjin Kwon ,  Gyeongtae Park ,  Yangwook Kim ,  Jihea Park

IPC: G09F9/30 ,  G06F1/16 ,  G06F3/0346 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a housing, a flexible display, a memory storing executable instructions, and at least one processor, wherein the instructions are configured to, when executed, enable the at least one processor to identify a first event triggering a first display operation for displaying an image based on a rotation of the electronic device, identify a second event triggering a second display operation for displaying an image based on a change in an area of the flexible display, and sequentially change a display attribute of an image displayed on the flexible display.

公开(公告)号：US12288349B2

公开(公告)日：2025-04-29

申请号：US17516990

申请日：2021-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  University of Seoul Industry Cooperation Foundation

Inventor： Myungjae Jeon ,  Kichul Kim ,  Yongkyu Kim ,  Hongseok Lee ,  San Kim ,  Hyekwan Yun ,  Donggeun Lee

IPC: G06T7/579 ,  G02B27/01 ,  G06T7/80

Abstract: Provided is an accelerator provided in an electronic device and configured to perform simultaneous localization and mapping (SLAM), the accelerator including a factor graph database, a memory, and a back-end processor, wherein the back-end processor is configured to receive a first piece of data corresponding to map points and camera positions from the factor graph database, convert the received first piece of data into a matrix for the map points and a matrix for the camera positions, store, in the memory, results obtained by performing an optimization calculation on the matrix for the map points and a matrix for at least one camera position, among the camera positions, corresponding to the map points, and obtain a second piece of data optimized with respect to the first piece of data based on the results stored in the memory.

公开(公告)号：US12288315B2

公开(公告)日：2025-04-29

申请号：US17886172

申请日：2022-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bin Sun ,  Yanlong Sun ,  Yong A ,  Wei Li ,  Lanlan Zhang ,  Zhezhu Jin ,  Yingying Jiang

IPC: G06K9/00 ,  G06T3/4046 ,  G06T5/20 ,  G06T5/50 ,  G06T5/90 ,  G06T7/11 ,  G06V10/44 ,  G06V10/74 ,  G06V10/764 ,  G06V10/77 ,  G06V10/82 ,  G06V10/94 ,  G06V40/16

Abstract: The present disclosure provides methods, apparatuses, and computer-readable mediums for image processing. In some embodiments, a method of image processing includes acquiring, from a user, a first image. The method further includes removing, using an image de-filter network, a filter effect applied to the first image to generate a second image. The method further includes obtaining, based on the first image and the second image, an image filter corresponding to the filter effect. The method further includes rendering a third image using the obtained image filter to output a fourth image.

公开(公告)号：US12288030B2

公开(公告)日：2025-04-29

申请号：US17739827

申请日：2022-05-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jiwan Kim ,  Jonghyun Kim ,  Soyoon Park ,  Indong Lee ,  Sungjun Lim

IPC: G06V30/148 ,  G06F40/289 ,  G06F40/58 ,  G06V30/19

Abstract: An electronic apparatus and a control method thereof are provided. The control method includes acquiring a plurality of words, acquire a plurality of word combinations by combining the plurality of words, and acquiring first scores indicating the sentence completeness of each of the plurality of word combinations by inputting each of the plurality of word combinations to a first a language model for identifying a sentence completeness, based on all the first scores with respect to each of the plurality of word combinations being identified to be less than a predetermined value, acquire second scores for each of the plurality of word combinations by inputting each of the plurality of word combinations to a sentence separation model for identifying an accuracy of a word combination, identifying one word combination among the plurality of word combinations based on the second scores, and providing the identified one word combination to a translation model which performs translation.

公开(公告)号：US12288001B2

公开(公告)日：2025-04-29

申请号：US18615381

申请日：2024-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bokun Choi ,  Minho Kang ,  Gajin Song ,  Jaeyung Yeo

IPC: G06F3/14 ,  G06F3/0488 ,  G06F3/023 ,  G06F3/0354

Abstract: Disclosed are an electronic device for controlling at least one input device and a control method thereof. An electronic device, according to an embodiment of the disclosure, may: acquire identification information of an external display device based on the electronic device being operably connected to the external display device; acquire identification information of at least one input device from the at least one input device located within a threshold proximity of the electronic device; compare the acquired identification information of the at least one input device with reference information of the input device associated with the identification information of the external display device and stored in the memory; and connect to the at least one input device based on a result of the comparison.

公开(公告)号：US12287987B2

公开(公告)日：2025-04-29

申请号：US17869531

申请日：2022-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won-Jo Lee ,  Hyunsoo Kim ,  Seungwon Lee

IPC: G06F12/00 ,  G06F3/06

Abstract: A data processing apparatus and method are disclosed. The data processing apparatus may include a host core configured to generate a control message to control a direct memory access (DMA), the DMA configured to generate a memory request based on the control message, a memory controller configured to generate a memory command based on the memory request, and a processor configured to perform an operation in a memory based on the memory command.