公开(公告)号：US20170182795A1

公开(公告)日：2017-06-29

申请号：US15390141

申请日：2016-12-23

Applicant: Rohm Co., Ltd.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: B41J2/335 ,  B41J2/34

CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

Abstract: A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

公开(公告)号：US09937728B2

公开(公告)日：2018-04-10

申请号：US15500607

申请日：2015-08-22

Applicant: KYOCERA Corporation

Inventor： Yousuke Iwamoto ,  Youichi Moto ,  Yuuna Ookubo ,  Arata Okayama

IPC: B41J2/335 ,  B41J2/345

CPC classification number: B41J2/3351 ,  B41J2/33515 ,  B41J2/3352 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/3357 ,  B41J2/33595 ,  B41J2/345 ,  H01R12/721

Abstract: A thermal head includes a substrate; a plurality of heating elements disposed on the substrate; a plurality of electrodes disposed on the substrate and electrically connected to the plurality of heating elements; a connector disposed adjacent to the substrate and including a plurality of connector pins including connection portions, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing containing the plurality of connector pins; and a covering member covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member includes a first portion located on the substrate and a second portion located on the housing. The second portion includes a first protrusion protruding toward the opening in a plan view.

公开(公告)号：US20170320334A1

公开(公告)日：2017-11-09

申请号：US15523211

申请日：2015-10-30

Applicant: KYOCERA Corporation

Inventor： Tsuyoshi ANDOU ,  Kouji OCHI ,  Hiroshi MASUTANI

IPC: B41J2/335

CPC classification number: B41J2/335 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3352 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/33565 ,  B41J2/3357 ,  B41J2/33595 ,  B41J2/345

Abstract: A thermal head includes a substrate; a plurality of heat generating portions; a common electrode disposed on the substrate and electrically connected to the plurality of heat generating portions; a plurality of individual electrodes disposed on the substrate and each electrically connected to a corresponding one of the plurality of heat generating portions; a first insulation layer disposed on the heat generating portions, a part of the common electrode, and a part of the individual electrodes; a second insulation layer located adjacent to the first insulation layer and disposed on a part of the individual electrodes; and a static removing layer disposed on the first insulation layer and grounded. The static removing layer includes a first portion disposed on an upper surface of the first insulation layer and a second portion electrically connected to the first portion and disposed on an upper surface of the second insulation layer.

公开(公告)号：US20170182794A1

公开(公告)日：2017-06-29

申请号：US15386884

申请日：2016-12-21

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: B41J2/335 ,  B41J2/34

CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

Abstract: A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

公开(公告)号：US20170151809A1

公开(公告)日：2017-06-01

申请号：US15321089

申请日：2015-06-18

Applicant: KYOCERA Corporation

Inventor： Masafumi HIRAYAMA ,  Yuuna OOKUBO ,  Yasumitsu YAMAMOTO ,  Youichi MOTO ,  Yui TANAKA ,  Hisatoshi TAKADA

IPC: B41J2/335

CPC classification number: B41J2/33595 ,  B41J2/335 ,  B41J2/35

Abstract: A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is electrically connected to the heat generating section; and a connector including a fixing ping electrically connected to the electrode, a movable pin which holds the substrate between the movable pin and the fixing pin, and a connection pin which connects the fixing pin and the movable pin. The movable pin includes a movable section which is bent or curved and a contact section making contact with the substrate. The movable pin is disposed so as to protrude from the connection pin beyond the fixing pin. The contact section is located closer to a connection pin side than a tip end of the fixing pin.

公开(公告)号：US09573371B2

公开(公告)日：2017-02-21

申请号：US15014071

申请日：2016-02-03

Applicant: SEIKO EPSON CORPORATION

Inventor： Toshiaki Hamaguchi ,  Eiju Hirai ,  Yoichi Naganuma ,  Motoki Takabe

IPC: B41J2/335 ,  B41J2/14

CPC classification number: B41J2/14201 ,  B41J2/14032 ,  B41J2/14233 ,  B41J2/33595 ,  B41J2002/14241 ,  B41J2002/14491

Abstract: Provided is a head including a channel formation substrate that is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid, a piezo element, a driving circuit board that is bonded to the one surface side of the channel formation substrate, and a driving circuit for driving the piezo element. The piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board. A holding portion that holds the piezo element is provided between the driving circuit board and the channel formation substrate. The holding portion is opened to an atmosphere through an atmosphere open passage which is provided to penetrate the driving circuit board in a direction in which the driving circuit board and the channel formation substrate are stacked.

Abstract translation: 本发明提供一种头部，其包括：通道形成基板，设置有与用于喷射液体的喷嘴连通的压力产生室;压电元件;接合到通道形成基板的一个表面侧的驱动电路板;以及 用于驱动压电元件的驱动电路。 压电元件和驱动电路通过设置在通道形成基板和驱动电路板中的任一个上的凸块彼此电连接。 保持压电元件的保持部设置在驱动电路基板和沟道形成基板之间。 保持部通过设置成沿驱动电路基板和通道形成基板堆叠的方向贯通驱动电路基板的大气开放通道向大气开放。

公开(公告)号：US06339444B1

公开(公告)日：2002-01-15

申请号：US09700063

申请日：2000-11-08

Applicant: Hayami Sugiyama

Inventor： Hayami Sugiyama

IPC: B41J2335

CPC classification number: B41J2/33515 ,  B41J2/33525 ,  B41J2/3357 ,  B41J2/33595 ,  B41J2/345

Abstract: A thermal head of the present invention comprises a substrate (1221) consisting of a metal such as a stainless steel, insulating layers (1226, 1223), with raised portions (1225, 1224) being formed by raising up a part of the surface thereof, and exothermic resistors (1228, 1229) formed on the raised portions. Common electrodes (1222, 1227) are disposed on the substrate, which protrude from the surface of the substrate, penetrate through the raised portions and are connected to the exothermic resistors, to thereby divide the resistors into first exothermic resistors and second exothermic resistors, centering on the connecting point.

Abstract translation: 本发明的热敏头包括由诸如不锈钢的金属组成的基底（1221），绝缘层（1226,1223）和凸起部分（1225,1224）之间形成有一部分表面 ，以及形成在凸起部分上的放热电阻（1228,1229）。 公共电极（1222,1227）设置在从基板的表面突出的基板上，穿过凸起部分并连接到放热电阻器，从而将电阻器分成第一放热电阻器和第二放热电阻器，定心 在连接点。

公开(公告)号：US5066960A

公开(公告)日：1991-11-19

申请号：US503974

申请日：1990-04-04

Applicant: Katsuyasu Deguchi ,  Takatoshi Mizoguchi ,  Takayuki Taminaga ,  Akiyoshi Fujii

Inventor： Katsuyasu Deguchi ,  Takatoshi Mizoguchi ,  Takayuki Taminaga ,  Akiyoshi Fujii

IPC: B41J2/335

CPC classification number: B41J2/3357 ,  B41J2/33595

Abstract: A thermal printing head includes an insulating substrate formed of a heat resisting cloth impregnated with a heat resisting resin. A plurality of heating elements of an electrically resistive material are linearly disposed on the substrate. A shield layer is interposed between the heating elements and the substrate for preventing the substrate from exerting chemical influence on the heating elements. A plurality of conduction controlling devices mounted on the substrate is included for controlling electric conduction of the heating elements corresponding to print data. A common electrode is formed on the substrate for commonly connecting an end of each of the heating elements. A discrete electrode is formed on the substrate for connecting the other end of each of the heating elements to the conduction controlling device. Finally, metal layer is interposed between the heating elements and the electrodes for connecting both of them in an ohmic contact.

公开(公告)号：US4250375A

公开(公告)日：1981-02-10

申请号：US045933

申请日：1979-06-06

Applicant: Tadashi Tsutsumi ,  Mamoru Mizuguchi

Inventor： Tadashi Tsutsumi ,  Mamoru Mizuguchi

IPC: B41J2/335 ,  B41J2/345 ,  H05B1/00

CPC classification number: B41J2/3351 ,  B41J2/33525 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/33595

Abstract: A thermal recording head which comprises a plurality of heat-generating resistors; an insulation substrate on which a plurality of separate conductors are mounted to be connected to the heat-generating resistors directly or with diodes interposed therebetween; and a 3-ply conductor holder formed of an insulation sheet, an assembly of common conductors mounted on the insulation sheet at a prescribed interval and an insulation layer deposited on the common conductors with a thickness of 2 to 20 microns, and wherein the insulation layer has openings arranged at a prescribed interval; and the insulation substrate is laminated with the conductor holder with the common conductors connected to the separate conductors.

Abstract translation: 一种热敏记录头，包括多个发热电阻器; 绝缘基板，其上安装有多个分离的导体，以直接连接到发热电阻器或者插入其中的二极管; 以及由绝缘片形成的3层导线架，以规定间隔安装在绝缘片上的公共导体的组件和沉积在公共导体上的绝缘层，厚度为2至20微米，并且其中绝缘层 具有以规定间隔布置的开口; 并且绝缘基板与导体保持器层叠，其中公共导体连接到单独的导体。