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公开(公告)号：US10514574B2
公开(公告)日：2019-12-24
申请号：US15577691
申请日：2017-08-03
Inventor： Yan Cheng
IPC: G02F1/1335 , G02F1/13357
Abstract: The present disclosure discloses a direct type backlight module, which includes a back plate and a light source disposed on the back plate, wherein the light source includes a printed circuit board and a plurality of micro-LED chips electrically connected to the printed circuit board, the plurality of micro-LED chips are arranged in a matrix array on the printed circuit board, and a light shielding unit is disposed between any adjacent two micro-LED chips; and the printed circuit board is further connected with a backlight driving chip thereon which drives each of the plurality of micro-LED chips independently. The present disclosure further provides a liquid crystal display which includes the abovementioned direct type backlight module.
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公开(公告)号：US20190302529A1
公开(公告)日：2019-10-03
申请号：US16211500
申请日：2018-12-06
Inventor： Guowei Zha , Hongqing Cui , Changwen Ma , Yan Cheng
IPC: G02F1/1335 , G02F1/1333
Abstract: The present disclosure provides backlight module and display module. The backlight module may include: a display module and a backlight module, the backlight module is configured to face to the display module, the display module may include a first substrate, a second substrate and a liquid crystal layer interposed between the first substrate and the second substrate; the display module comprising a display region and a non-display region, at least one side of the second substrate extends along the non-display region and is bent below the backlight module so as to cover a portion of the backlight module.
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公开(公告)号：US10416486B2
公开(公告)日：2019-09-17
申请号：US16024071
申请日：2018-06-29
IPC: G02F1/1333 , G02F1/1335
Abstract: A backlight module and display device is disclosed. The backlight module includes a light-shielding adhesive, a plastic frame, a reflective sheet, a light guide plate and an optical film. Wherein the reflective sheet, the light guide plate and the optical film are sequentially stacked, the plastic frame surrounds the reflective sheet, the light guide plate and the optical film; the light-shielding adhesive includes a first section and a second section connected with the first section, the first section is a double-sided adhesive, and the second section is a single-side adhesive, the first section is adhered to the plastic frame and the reflective sheet; one portion of the second section is adhered to an end surface of the plastic frame, the other portion of the second section is extended out from the backlight module. Accordingly, the present invention can realize a narrow-frame backlight module.
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公开(公告)号：US10381518B2
公开(公告)日：2019-08-13
申请号：US15529511
申请日：2017-04-10
Inventor： Yan Cheng
Abstract: The present invention provides a light-emitting diode. The light-emitting diode includes: an emissive layer, an electron transportation layer and a hole transportation layer that are respectively set in contact with upper and lower surfaces of the emissive layer, a first electrode set in contact with the hole transportation layer, and a second electrode set in contact with the electron transportation layer; and the electron transportation layer is formed of a material comprising graphene so that the excellent electrical conduction property and heat conduction capability of the graphene material help improve the heat dissipation capability and electron transportation capability of the light-emitting diode the electron transportation layer so as to enhance the service life and lighting efficiency of the light-emitting diode.
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公开(公告)号：US20180106949A1
公开(公告)日：2018-04-19
申请号：US15109127
申请日：2016-05-25
IPC: F21V8/00
CPC classification number: G02B6/0053 , G02B6/0051 , G02B6/0055 , G02B6/0065 , G02B6/0088
Abstract: The present invention provides a backlight module and a liquid crystal display device. The backlight module of the present invention includes an upper brightness enhancement film (7), which includes a central zone (71) and a lens zone (72) located between the central zone (71) and a mold frame (1). The upper brightness enhancement film (7) includes a prism structure formed on an upper surface of the central zone (71); and the upper brightness enhancement film (7) includes a lens structure formed on an upper surface of the lens zone (72). The lens structure includes a plurality of concave surfaces (721) arranged in sequence in a side-by-side manner from an edge of the upper brightness enhancement film (7) toward interior thereof. The prism structure and the lens structure of the upper brightness enhancement film (7) are integrally formed together. The lens structure of the upper brightness enhancement film (7) helps diverge light projecting outward so as to have a part of the light extending over and covering a portion of an area shielded by the light-shielding tape (8), expanding a view area of the backlight module to thereby achieving a visual effect of narrowing bezel. Further, the manufacturing process is simplified, the manufacturing cost is reduced, and product yield is increased.
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Patent Agency Ranking
公开(公告)号：US10824008B2
公开(公告)日：2020-11-03
申请号：US16211500
申请日：2018-12-06
Inventor： Guowei Zha , Hongqing Cui , Changwen Ma , Yan Cheng
IPC: G02F1/1335 , G02F1/13357 , G02F1/1333
Abstract: The present disclosure provides backlight module and display module. The backlight module may include: a display module and a backlight module, the backlight module is configured to face to the display module, the display module may include a first substrate, a second substrate and a liquid crystal layer interposed between the first substrate and the second substrate; the display module comprising a display region and a non-display region, at least one side of the second substrate extends along the non-display region and is bent below the backlight module so as to cover a portion of the backlight module.
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公开(公告)号：US20180309028A1
公开(公告)日：2018-10-25
申请号：US15529511
申请日：2017-04-10
Inventor： Yan Cheng
CPC classification number: H01L33/40 , H01L33/04 , H01L33/14 , H01L33/32 , H01L33/387
Abstract: The present invention provides a light-emitting diode. The light-emitting diode includes: an emissive layer, an electron transportation layer and a hole transportation layer that are respectively set in contact with upper and lower surfaces of the emissive layer, a first electrode set in contact with the hole transportation layer, and a second electrode set in contact with the electron transportation layer; and the electron transportation layer is formed of a material comprising graphene so that the excellent electrical conduction property and heat conduction capability of the graphene material help improve the heat dissipation capability and electron transportation capability of the light-emitting diode the electron transportation layer so as to enhance the service life and lighting efficiency of the light-emitting diode.
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公开(公告)号：US11086157B1
公开(公告)日：2021-08-10
申请号：US17049355
申请日：2020-08-24
Inventor： Wei Zhou , Gege Zhou , Chao Liang , Zhongjie Liu , Yan Cheng
IPC: G02F1/1333 , F21V8/00
Abstract: A display device is provided, which includes a middle frame, a first substrate, a second substrate, a cover plate, an ink layer, and a silicone glue. By providing a barrier block or a slot disposed on a side of the ink layer close to the first substrate, the barrier block is disposed between the silicone glue and a side frame to prevent the ink layer on the cover plate from spreading of a pollution source, so that a surface of the ink layer of a glass cover plate of a display module can meet dyne specification requirements. It also ensures an adhesive strength of the middle frame and the cover plate to prevent bonding failure.
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公开(公告)号：US10509278B2
公开(公告)日：2019-12-17
申请号：US16009902
申请日：2018-06-15
IPC: G02F1/1345 , G02F1/1333 , H05K1/18 , H05K1/02
Abstract: The present disclosure relates to a chip on film (COF) single-layer flexible printed circuit board, including: a flexible packaging substrate including a bonding area and a controlling chip being packaged on the flexible packaging substrate. The bonding area of the flexible packaging substrate is configured to bond with a bonding area of an array substrate. The controlling chip electrically connects to the bonding area of the flexible packaging substrate. The controlling chip and the bonding area of the flexible packaging substrate are configured on the same side of the flexible packaging substrate, and a portion of the flexible packaging substrate is bent at least one time. As such, the controlling chip faces away the array substrate, the cost and the complexity of the post-process may be reduced, and the COF single-layer flexible printed circuit board may be shipped in the folding manner.
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公开(公告)号：US20190004239A1
公开(公告)日：2019-01-03
申请号：US15567731
申请日：2017-07-25
IPC: F21V8/00
Abstract: The present disclosure discloses a backlight module including a light guide plate, an optical diaphragm group disposed on a light exiting surface of the light guide plate, and a backlight source disposed at a light incident end of the light guide plate, a middle frame, a radiating fin and a heat conducting connector. The middle frame is disposed on an outer surface of the backlight module and includes a bottom plate and a side wall. The radiating fin is attached to an internal surface of the bottom plate of the middle frame, and the heat conducting connector includes a first portion that contacts the backlight source and a second portion that only contacts a partial region of the radiating fin. The present disclosure also discloses a mobile terminal.
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