Abstract:
A method and apparatus for fabricating a cutter. The method includes obtaining a compact including a cutting surface, a bonding interface, and a sidewall extending from the perimeter of the cutting surface to the perimeter of the bonding interface. The method includes obtaining a substrate including a bonding surface, a mounting surface, and a substrate sidewall extending from the perimeter of the bonding surface to the perimeter of the mounting surface. At least a portion of the bonding interface is positioned adjacent at least a portion of the bonding surface. At least one of the substrate and the compact is rotated to produce a rotational differential therebetween. The temperature is increased on at least the bonding surface to a first temperature. The compact is coupled to the substrate to form the cutter. The apparatus includes a first holder coupled to the compact and a second holder coupled to the substrate.