ATTACHMENT OF THERMALLY STABLE POLYCRYSTALLINE TO A SUBSTRATE AND COMPACTS CONSTRUCTED
    11.
    发明申请
    ATTACHMENT OF THERMALLY STABLE POLYCRYSTALLINE TO A SUBSTRATE AND COMPACTS CONSTRUCTED 审中-公开
    将稳定的多晶硅结合到基板上并进行压接

    公开(公告)号:US20130067824A1

    公开(公告)日:2013-03-21

    申请号:US13622963

    申请日:2012-09-19

    Abstract: A method and apparatus for fabricating a cutter. The method includes obtaining a compact including a cutting surface, a bonding interface, and a sidewall extending from the perimeter of the cutting surface to the perimeter of the bonding interface. The method includes obtaining a substrate including a bonding surface, a mounting surface, and a substrate sidewall extending from the perimeter of the bonding surface to the perimeter of the mounting surface. At least a portion of the bonding interface is positioned adjacent at least a portion of the bonding surface. At least one of the substrate and the compact is rotated to produce a rotational differential therebetween. The temperature is increased on at least the bonding surface to a first temperature. The compact is coupled to the substrate to form the cutter. The apparatus includes a first holder coupled to the compact and a second holder coupled to the substrate.

    Abstract translation: 一种用于制造切割器的方法和装置。 该方法包括获得包括切割表面,接合界面和从切割表面的周边延伸到粘结界面的周边的侧壁的压块。 该方法包括获得包括接合表面,安装表面和从接合表面的周边延伸到安装表面的周边的衬底侧壁的衬底。 粘合界面的至少一部分定位成与粘合表面的至少一部分相邻。 基板和压块中的至少一个被旋转以在它们之间产生旋转差速器。 至少在粘合表面上的温度升至第一温度。 紧凑件联接到基板以形成切割器。 该装置包括耦合到该压块的第一保持器和联接到该衬底的第二保持器。

Patent Agency Ranking