公开(公告)号：US11503394B2

公开(公告)日：2022-11-15

申请号：US17074646

申请日：2020-10-20

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Huming Zheng

IPC: H04R25/00 ,  H04R1/10

Abstract: A TWS bone conduction earphone includes an earphone housing and an earphone body. The earphone housing is configured to accommodate the earphone body. The earphone body includes a storage module, a Bluetooth module and a bone conduction module. The storage module is configured to store a Bluetooth address corresponding to a Bluetooth device to be connected and paired. The Bluetooth module is configured to establish a communication with the corresponding Bluetooth device according to the Bluetooth address to obtain an audio signal from the Bluetooth device. The bone conduction module vibrates according to the audio signal for transmitting sounds through ossicles. Using Bluetooth technology, bone conduction wireless answering is realized, without the restriction of the earphone cable. It is more convenient to use, and the sound transmission is realized through bone conduction without damaging hearing.

公开(公告)号：US20210352394A1

公开(公告)日：2021-11-11

申请号：US17074646

申请日：2020-10-20

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Huming Zheng

IPC: H04R1/10

Abstract: A TWS bone conduction earphone includes an earphone housing and an earphone body. The earphone housing is configured to accommodate the earphone body. The earphone body includes a storage module, a Bluetooth module and a bone conduction module. The storage module is configured to store a Bluetooth address corresponding to a Bluetooth device to be connected and paired. The Bluetooth module is configured to establish a communication with the corresponding Bluetooth device according to the Bluetooth address to obtain an audio signal from the Bluetooth device. The bone conduction module vibrates according to the audio signal for transmitting sounds through ossicles. Using Bluetooth technology, bone conduction wireless answering is realized, without the restriction of the earphone cable. It is more convenient to use, and the sound transmission is realized through bone conduction without damaging hearing.

公开(公告)号：US20180184193A1

公开(公告)日：2018-06-28

申请号：US15813164

申请日：2017-11-15

Applicant: Transound Electronics Co., Ltd.

Inventor： Huming Zheng ,  Zhijian He ,  Xiaolin Deng ,  Tseng-Feng Wen

IPC: H04R1/10 ,  H04R19/02

CPC classification number: H04R1/1066 ,  H04R1/1016 ,  H04R1/105 ,  H04R19/02

Abstract: An electrostatic loudspeaker and an electrostatic headphone are provided. The electrostatic loudspeaker includes a first back grid portion, a second back grid portion, a diaphragm portion, and an audio amplifier circuit module. The two polarized and charged back grid portions are combined with the diaphragm portion to form two alternating electric fields, providing great sound. The structure is simple and can be assembled conveniently.