公开(公告)号：US20190333785A1

公开(公告)日：2019-10-31

申请号：US16394320

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Takehiro TANIKAWA

IPC: H01L21/67 ,  H01J37/32

Abstract: There is provision of a substrate processing apparatus including an inner edge ring provided in a vicinity of a substrate to be placed on a stage in a processing chamber; a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism; an outer edge ring arranged outside the middle edge ring; a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring.