公开(公告)号：US20090229740A1

公开(公告)日：2009-09-17

申请号：US12395908

申请日：2009-03-02

Applicant: Takashi YOSHINO

Inventor： Takashi YOSHINO

IPC: B29C65/00

CPC classification number: G02F1/3775 ,  G02F2201/066 ,  G02F2201/38 ,  G02F2202/20 ,  G02F2202/28 ,  Y10T156/1002 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: It is provided a chip 12 having a supporting substrate 2, a wavelength conversion layer 5, a base adhesive layer 3 made of an organic resin, an upper-side substrate 11 provided on an upper surface side of the wavelength conversion layer 5, and an upper-side adhesive layer 10 made of an organic resin for adhering the wavelength conversion layer 5 to the upper-side substrate 11. The wavelength conversion layer 5 has an optical waveguide with a periodic domain inversion structure provided therein. The chip 12 is heat treated. Anti-reflection films are formed on an incident side end face and projection side end face of the optical waveguide, respectively.

Abstract translation: 提供了具有支撑基板2，波长转换层5，由有机树脂制成的基底粘合层3，设置在波长转换层5的上表面侧的上侧基板11的芯片12，以及 由用于将波长转换层5粘附到上侧基板11的由有机树脂制成的上侧粘合层10.波长转换层5具有设置在其中的具有周期性畴反转结构的光波导。 芯片12被热处理。 防反射膜分别形成在光波导的入射侧端面和突出侧端面上。