公开(公告)号：US20220102307A1

公开(公告)日：2022-03-31

申请号：US17544888

申请日：2021-12-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00

Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

公开(公告)号：US20200321304A1

公开(公告)日：2020-10-08

申请号：US16843717

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Scott Robert SUMMERFELT ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00

Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.