公开(公告)号：US20210304968A1

公开(公告)日：2021-09-30

申请号：US17207212

申请日：2021-03-19

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Eiko WAKATA

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G2/06

Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.

公开(公告)号：US20250069814A1

公开(公告)日：2025-02-27

申请号：US18841735

申请日：2023-01-26

Applicant: TDK CORPORATION

Inventor： Miyu HASEGAWA ,  Daiki ISHII

IPC: H01G4/33 ,  H01G2/06 ,  H01G4/232

Abstract: To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.

公开(公告)号：US20230268133A1

公开(公告)日：2023-08-24

申请号：US18012135

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI ,  Yuki YAMASHITA

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/008 ,  H01G4/228 ,  H01G2/06

CPC classification number: H01G4/33 ,  H01G2/065 ,  H01G4/008 ,  H01G4/10 ,  H01G4/228

Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

公开(公告)号：US20230335579A1

公开(公告)日：2023-10-19

申请号：US18012553

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01L23/495 ,  H01L25/16

CPC classification number: H01L28/84 ,  H01L25/16

Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member provided on the upper surface of the metal foil to surround the first and second electrode layers. The metal foil has an outer peripheral area which is positioned outside an area surrounded by the insulating member and which is not covered with the first and second electrode layers. A height of the electrode layer is equal to or higher than a height of the insulating member. This makes the outer peripheral portion of the thin film capacitor have a step-like shape.

公开(公告)号：US20230260713A1

公开(公告)日：2023-08-17

申请号：US18012820

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/33 ,  H01G4/228 ,  H01G4/005 ,  H01G4/06

CPC classification number: H01G4/33 ,  H01G4/228 ,  H01G4/005 ,  H01G4/06

Abstract: To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

公开(公告)号：US20230253161A1

公开(公告)日：2023-08-10

申请号：US18012518

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

IPC: H01G4/33 ,  H01L25/16 ,  H01G4/01 ,  H01G4/012 ,  H01G4/10 ,  H01G4/12

CPC classification number: H01G4/33 ,  H01L25/16 ,  H01G4/01 ,  H01G4/012 ,  H01G4/10 ,  H01G4/1218 ,  H01G4/1254 ,  H01G4/1209 ,  H01L24/16

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The first and second electrode layers are formed in an area surrounded by an outer peripheral area of the upper surface of the metal foil so as not to cover the outer peripheral area. The outer peripheral area of the roughened upper surface of the metal foil is thus exposed, so that adhesion performance with respect to a circuit substrate can be enhanced.

公开(公告)号：US20190287726A1

公开(公告)日：2019-09-19

申请号：US16354373

申请日：2019-03-15

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Daiki ISHII ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/30 ,  H01G4/012 ,  H01G4/06

Abstract: A thin film capacitor includes a capacitance portion in which a plurality of electrode layers and dielectric layers are alternately laminated, a cover layer, an insulating layer, a via hole in which one electrode layer different from an uppermost electrode layer among the plurality of electrode layers is exposed at a bottom surface thereof, and an opening which is provided inside the via hole and in which the one electrode layer is exposed at a bottom surface thereof, and in which the cover layer and the insulating layer are exposed at a side surface. The opening includes a first opening portion which passes through the insulating layer and a second opening portion which is provided below the first opening portion and passes through the cover layer, and when an inner diameter of the first opening portion is D1 and an inner diameter of the second opening portion is D2, D1>D2.