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11.
公开(公告)号:US11757189B2
公开(公告)日:2023-09-12
申请号:US17705254
申请日:2022-03-25
Applicant: Silicon Laboratories Inc.
Inventor: Attila Zolomy , Pasi Rahikkala , Thomas E. Voor
CPC classification number: H01Q7/00 , H01Q1/2225 , H01Q1/50 , H01Q9/14 , H01Q23/00
Abstract: An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals. The apparatus further includes a loop antenna to transmit or receive the RF signals. The apparatus further includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.
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12.
公开(公告)号:US20220216608A1
公开(公告)日:2022-07-07
申请号:US17705254
申请日:2022-03-25
Applicant: Silicon Laboratories Inc.
Inventor: Attila Zolomy , Pasi Rahikkala , Thomas E. Voor
Abstract: An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals. The apparatus further includes a loop antenna to transmit or receive the RF signals. The apparatus further includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.
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13.
公开(公告)号:US20190280383A1
公开(公告)日:2019-09-12
申请号:US16420116
申请日:2019-05-22
Applicant: Silicon Laboratories Inc.
Inventor: Attila Zolomy , Thomas E. Voor , Zoltan Vida
Abstract: An apparatus includes a substrate and a loop antenna formed using the substrate. The loop antenna includes a set of gaps formed to isolate a first part of the loop antenna from a second part of the loop antenna.
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14.
公开(公告)号:US20190140352A1
公开(公告)日:2019-05-09
申请号:US16237583
申请日:2018-12-31
Applicant: Silicon Laboratories Inc.
Inventor: Attila Zolomy , Pasi Rahikkala , Thomas E. Voor
Abstract: An apparatus includes a radio frequency (RF) circuit to transmit or receive RF signals. The apparatus further includes a loop antenna to transmit or receive the RF signals. The apparatus further includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.
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