DEFECT DETECTION STRUCTURES, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND METHODS OF DETECTING DEFECTS IN SEMICONDUCTOR DIES

    公开(公告)号:US20210311104A1

    公开(公告)日:2021-10-07

    申请号:US17061380

    申请日:2020-10-01

    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop passing through the left-bottom corner region, a second conduction loop passing through the right-bottom corner region, a third conduction loop passing through the left-bottom corner region and the left-upper corner region, a fourth conduction loop passing through the right-bottom corner region and the right-upper corner region, and a shielding loop to shield electrical interference between the first through fourth conduction loops. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.

    Apparatus and method for calibrating mismatches of time-interleaved analog-to-digital converter

    公开(公告)号:US12224759B2

    公开(公告)日:2025-02-11

    申请号:US17863167

    申请日:2022-07-12

    Abstract: An apparatus and a method of correcting a mismatch of a time-interleaved analog-to-digital converter are provided. The apparatus may include: a time-interleaved analog-to-digital converter configured to receive a non-return-to-zero (NRZ) signal in a correction mode and generate a first output signal, and including a plurality of analog-to-digital converters; and a mismatch corrector configured to generate a second output signal by processing the first output signal of the time-interleaved analog-to-digital converter based on parameters, wherein the parameters may be generated based on the first output signal of the time-interleaved analog-to-digital converter in the correction mode, and a period of the NRZ signal may be different from a product of a sampling period of the time-interleaved analog-to-digital converter and a number of the plurality of analog-to-digital converters included in the time-interleaved analog-to-digital converter.

    Defect detection structures, semiconductor devices including the same, and methods of detecting defects in semiconductor dies

    公开(公告)号:US11796587B2

    公开(公告)日:2023-10-24

    申请号:US17061380

    申请日:2020-10-01

    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop passing through the left-bottom corner region, a second conduction loop passing through the right-bottom corner region, a third conduction loop passing through the left-bottom corner region and the left-upper corner region, a fourth conduction loop passing through the right-bottom corner region and the right-upper corner region, and a shielding loop to shield electrical interference between the first through fourth conduction loops. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.

Patent Agency Ranking