公开(公告)号：US20210156904A1

公开(公告)日：2021-05-27

申请号：US16924971

申请日：2020-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Meehyun Lim ,  Sungyeol Kim ,  Hyungjung Yong ,  Jinyeong Yun

IPC: G01R31/28 ,  H01L23/00 ,  H01L25/065

Abstract: A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.