公开(公告)号：US20130286593A1

公开(公告)日：2013-10-31

申请号：US13873342

申请日：2013-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il CHO ,  Seung Heun LEE ,  Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  B06B1/0292 ,  G01N29/2406 ,  G01N29/326 ,  H05K1/0204 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10598

Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

Abstract translation: 提供了一种超声波探头，其中释放了结合到cMUT的集成电路中产生的热量。 超声波探头包括被配置为产生超声波的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上的印刷电路板，并且具有开口， 集成电路的后表面至少部分地露出，散热器具有插入印刷电路板的开口中的突起，并且被构造成吸收集成电路中产生的热量，散热模块被配置为释放 散热器吸收的热量到外面。