公开(公告)号：US20240085812A1

公开(公告)日：2024-03-14

申请号：US18230472

申请日：2023-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhee Han ,  Koungmin Ryu ,  Kyeongbeom Park ,  Jongmin Baek ,  Wookyung You ,  Woojin Lee ,  Juhee Lee

IPC: G03F7/00 ,  G03F7/20 ,  G03F7/40 ,  H01L21/033

CPC classification number: G03F7/70925 ,  G03F7/2004 ,  G03F7/40 ,  H01L21/033

Abstract: A substrate processing apparatus includes a chamber having an internal space configured to process a substrate loaded therein; a light source configured to emit light on the substrate to harden a photoresist pattern coated on the substrate; and a transparent division part provided between the substrate and the light source, wherein the transparent division part divides the chamber into a first space, in which the light source is provided, and a second space, in which the substrate is provided.