公开(公告)号：US20200329556A1

公开(公告)日：2020-10-15

申请号：US16844590

申请日：2020-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwanghyun BAEK ,  Juneseok LEE ,  Dohyuk HA ,  Junsig KUM ,  Kijoon KIM ,  Youngju LEE ,  Jungyub LEE ,  Jinsu HEO

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/42 ,  H01Q1/50 ,  H01Q9/04 ,  H01Q1/22

Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module and a base station including the antenna module. The antenna module includes a printed circuit board in which at least one layer is stacked, a feeding unit disposed at one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length.

公开(公告)号：US20200321711A1

公开(公告)日：2020-10-08

申请号：US16906476

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwanghyun BAEK ,  Seungtae KO ,  Kijoon KIM ,  Juho SON ,  Sangho LEE ,  Youngju LEE ,  Jungyub LEE ,  Yonghun CHEON ,  Dohyuk HA

IPC: H01Q21/06 ,  H01Q1/24 ,  H04B7/0413 ,  H01Q1/42 ,  H05K1/18

Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.