公开(公告)号：US11049815B2

公开(公告)日：2021-06-29

申请号：US16584027

申请日：2019-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jooyoung Choi ,  Taewook Kim ,  Byungho Kim ,  Sangseok Hong ,  Jaehoon Choi ,  Seongjin Shin

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.

公开(公告)号：US10177096B2

公开(公告)日：2019-01-08

申请号：US15622708

申请日：2017-06-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoung-Gug Min ,  Sungil Cho ,  Jaehoon Choi ,  Shi-kyung Kim

IPC: H01L29/93 ,  H01L23/552 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: Semiconductor packages and a methods for manufacturing a semiconductor package are provided. The method includes providing a package including a substrate, a semiconductor chip provided on the substrate, and a molding layer provided on the substrate and covering the semiconductor chip, the substrate including a ground pattern exposed at one surface of the substrate; and applying a solution including metal particles and a conductive carbon material onto the molding layer to form a shielding layer covering the molding layer. The shielding layer includes the metal particles and the conductive carbon material connected to at least one of the metal particles. The shielding layer extends onto the one surface of the substrate and is electrically connected to the ground pattern.