公开(公告)号：US20210143026A1

公开(公告)日：2021-05-13

申请号：US17014335

申请日：2020-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungjun Jeon ,  Taeyeong Kim ,  Hoechul Kim ,  Junhong Min

IPC: H01L21/67 ,  H01L23/00 ,  B32B37/00 ,  B32B41/00

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck; a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface; a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.

公开(公告)号：US20210057263A1

公开(公告)日：2021-02-25

申请号：US16892492

申请日：2020-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoechul Kim ,  Taeyeong Kim ,  Hakjun ` Lee ,  Hoonjoo Na

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/50

Abstract: A substrate bonding apparatus includes a first bonding chuck configured to support a first substrate and a second bonding chuck configured to support a second substrate such that the second substrate faces the first substrate. The first bonding chuck includes a first base, a first deformable plate on the first base and configured to support the first substrate and configured to be deformed such that a distance between the first base and the first deformable plate is varied, and a first piezoelectric sheet on the first deformable plate and configured to be deformed in response to power applied thereto to deform the first deformable plate.