公开(公告)号：US20240421058A1

公开(公告)日：2024-12-19

申请号：US18644867

申请日：2024-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minkyu KIM ,  Dahee KIM ,  Khaile KIM ,  Kyuil HWANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor package may include a package structure on a redistribution structure. The redistribution structure may include a wiring structure and an insulating structure covering the wiring structure. The package structure may include a semiconductor chip connected to the wiring structure. The insulating structure of the redistribution structure may include a plurality of first insulating layers and a second insulating layer between the plurality of first insulating layers. The plurality of first insulating layers may include at least one of a first conductive line pattern and a first conductive via pattern. The second insulating layer may include a second conductive line pattern overlapping the first conductive line pattern in a vertical direction.

公开(公告)号：US20240345711A1

公开(公告)日：2024-10-17

申请号：US18754686

申请日：2024-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyang SONG ,  Dahee KIM ,  Teayoung KIM ,  Sunghwan PARK ,  Changhan LEE ,  Jihea PARK ,  Yangwook KIM ,  Myunghoon KWAK ,  Jookwan LEE

IPC: G06F3/0484 ,  G06F1/16 ,  G06F3/0481 ,  H04M1/72403 ,  H04M1/72469

CPC classification number: G06F3/0484 ,  G06F3/0481 ,  H04M1/72403 ,  H04M1/72469 ,  G06F1/1652

Abstract: A shape-changeable electronic apparatus according to an embodiment includes: a display module having a first area and a second area. In response to the shape of the electronic apparatus being a first shape, the first area is activated, and in response to the shape of the electronic apparatus being a second shape, the second area is activated. The electronic apparatus further includes a memory storing computer-executable instructions and a processor which executes the instructions. When the instructions are executed, in the first shape, first content related to a first application is displayed in the first area. Information is identified from the first content. The presence of a candidate application to which the identified information can be applied is determined. In response to the candidate application being present, a graphic object capable of receiving an input for changing the shape of the electronic apparatus is displayed on the first area.

公开(公告)号：US20230214174A1

公开(公告)日：2023-07-06

申请号：US18092524

申请日：2023-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wankyu KIM ,  Jooyoung KANG ,  Dahee KIM ,  Byungwoo MIN ,  Sangeun LEE ,  Moonjeong KIM ,  Sunghwan PARK ,  Jookwan LEE

IPC: G06F3/16 ,  H04M1/02

CPC classification number: G06F3/165 ,  H04M1/0268 ,  H04M1/0235 ,  H04M2201/38

Abstract: An example electronic device may include a housing, a flexible display, wherein at least a portion of the flexible display which is positioned in the housing is configured to be exposed to an outside of the housing as the housing slides, a speaker, and a processor operatively connected with the speaker and the flexible display. The processor may be configured to control the speaker to output a first sound at a first volume value while a state of the housing is a normal state, identify a size of a first area of the flexible display exposed to the outside, based on a first slide of the housing to change the state of the housing to an extended state, and control the speaker to output the first sound at a second volume value higher than the first volume value based on a size of the first area while the state of the housing is the extended state.

公开(公告)号：US20230052194A1

公开(公告)日：2023-02-16

申请号：US17884668

申请日：2022-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dahee KIM ,  Gookmi SONG

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/31

Abstract: Provided is a fan-out semiconductor package including a package body having a fan-in region and a fan-out region, the fan-out region surrounding the fan-in region and including a body wiring structure; a fan-in chip structure in the fan-in region, the fan-in chip structure comprising a chip and a chip wiring structure on a top surface of the chip; a first redistribution structure on a bottom surface of the package body and a bottom surface of the fan-in chip structure, the first redistribution structure comprising first redistribution elements extending towards the fan-out region; and a second redistribution structure on a top surface of the package body and a top surface of the chip wiring structure, the second redistribution structure comprising second redistribution elements extending towards the fan-out region.