公开(公告)号：US11747393B2

公开(公告)日：2023-09-05

申请号：US17703535

申请日：2022-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyun Kwon ,  Donghee Kim ,  Sungoh Huh

IPC: G01R31/28 ,  H01L23/48 ,  H01L23/522 ,  H01L25/065

CPC classification number: G01R31/2884 ,  H01L23/481 ,  H01L23/5227 ,  H01L25/0655

Abstract: An integrated circuit device, a semiconductor substrate, and a test system including the integrated circuit device are disclosed. The integrated circuit device includes a power terminal configured to receive a source voltage, a power via connected to the power terminal and passing through at least one of a number of layers, a number of inductive vias arranged apart from the power via and passing through at least one of the number of layers, a number of wirings connected to ends of at least some of the number of inductive vias and configured to form a coil wound in toroidal form together with the number of inductive vias, around the power via, and a test terminal configured to output an induced voltage in the coil externally of the integrated circuit device, in response to the supply of the source voltage.