公开(公告)号：US11612964B2

公开(公告)日：2023-03-28

申请号：US16862815

申请日：2020-04-30

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sung Yong Lee ,  Toshinaru Suzuki ,  Seung Ho Myoung ,  Gyeong Hee Han ,  Gyoo Wan Han

IPC: B23K26/38 ,  B23K26/70 ,  B23K26/12 ,  B23K101/40

Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

公开(公告)号：US11253952B2

公开(公告)日：2022-02-22

申请号：US16408276

申请日：2019-05-09

Applicant: Samsung Display Co., Ltd.

Inventor： Akifumi Sangu ,  Alexander Voronov ,  Hyoung-Joo Kim ,  Eun Sun Choi ,  Emil Aslanov ,  Gyoo Wan Han

IPC: B23K26/064 ,  G02B27/00 ,  B23K26/06 ,  G02B26/10 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/073 ,  B23K26/082

Abstract: A laser processing apparatus includes a light source configured to generate a laser beam, and a light converging optical system configured to converge laser beam to a focal point at an object to be processed, the light converging optical system including a through-hole optical element and a composite optical element under the through-hole optical element, wherein the through-hole optical element includes a first recess portion configured as a concave mirror at a lower surface of the through-hole optical element, and wherein an upper surface of the composite optical element is convex and includes a first region configured to reflect the laser beam and a second region configured to transmit the laser beam.

公开(公告)号：US10515832B2

公开(公告)日：2019-12-24

申请号：US15809537

申请日：2017-11-10

Applicant: Samsung Display Co. Ltd.

Inventor： Emil Aslanov ,  Je Kil Ryu ,  Hae Sook Lee ,  Young Geun Cho ,  Gyoo Wan Han

IPC: H01L21/67 ,  G02B19/00 ,  G02B27/12 ,  B23K26/06 ,  G02B26/08 ,  G02B27/09 ,  H01L27/12 ,  H01L21/02 ,  G02B27/00 ,  G02B3/00 ,  B23K26/067 ,  B23K103/00

Abstract: A laser processing apparatus includes a laser beam generating unit which emits a laser beam, a lens unit which divides the laser beam into a plurality of laser beams, and a light condensing unit which condenses the plurality of laser beams. The lens unit includes a first lens array having a first central axis and a second lens array having a second central axis, and wherein at least one of the first lens array and the second lens array reciprocates such that the first central axis and the second central axis are deviated from each other.

公开(公告)号：US09688094B2

公开(公告)日：2017-06-27

申请号：US14986973

申请日：2016-01-04

Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

Inventor： Il Young Jeong ,  Tae Yong Kim ,  Cheol Lae Roh ,  Je Kil Ryu ,  Jeong Hun Woo ,  Gyoo Wan Han ,  Ki Su Han ,  Tae Hyoung Cho ,  Jong Nam Moon

IPC: B44C1/22 ,  C03B33/09 ,  C03B33/02 ,  C03B33/07 ,  C03B33/08 ,  H01L21/78 ,  B23K26/06 ,  B23K26/38

CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.