公开(公告)号：US20220147115A1

公开(公告)日：2022-05-12

申请号：US17365017

申请日：2021-07-01

Applicant: SAMSUNG DISPLAY CO., LTD. ,  Seoul National University R&DB Foundation

Inventor： JUNGSUEK OH ,  SANGROCK YOON ,  KISEO KIM ,  BYEONGJIN KIM ,  JEONGTAEK OH

IPC: G06F1/16 ,  G06F3/041 ,  H01Q1/22 ,  H01Q1/24

Abstract: An electronic device includes a display layer, a sensor layer, a cover layer, and a driving chip. The display layer includes a peripheral area adjacent to an active area. The sensor layer is on the display layer and includes sensing electrodes and an antenna pattern. The cover layer is below the display layer and includes an opening overlapping the antenna pattern. The driving chip provides a signal to the antenna pattern through the opening in the cover layer.

公开(公告)号：US20220069440A1

公开(公告)日：2022-03-03

申请号：US17325841

申请日：2021-05-20

Applicant: Samsung Display Co., Ltd. ,  UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)

Inventor： Gangil BYUN ,  SANGROCK YOON ,  KISEO KIM ,  Donghyee HWANG

IPC: H01Q1/24 ,  H01Q1/44 ,  H01Q9/04 ,  H01Q5/35

Abstract: An electronic device includes a display panel including an antenna. The antenna includes a first antenna portion. A second antenna portion is spaced apart from the first antenna portion in a first direction. A plurality of intermediate antenna portions is disposed between the first antenna portion and the second antenna portion and is electrically connected to the first antenna portion and the second antenna portion. The first antenna portion includes a first pattern portion and a first line portion having a first width in a second direction crossing the first direction. The second antenna portion includes a second pattern portion and a second line portion having a second width in the second direction that is larger than the first width.

公开(公告)号：US20180033765A1

公开(公告)日：2018-02-01

申请号：US15661769

申请日：2017-07-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： JEONGHUN GO ,  JEONG-MO NAM ,  SANGROCK YOON

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/73 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8288 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/832 ,  H01L2224/8322 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.