DISPLAY DEVICE
    11.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230232690A1

    公开(公告)日:2023-07-20

    申请号:US18087947

    申请日:2022-12-23

    CPC classification number: H10K59/353 H10K59/40 H10K59/352

    Abstract: A display device includes first and second unit pixels adjacent to each other in a first direction. Each of the first and second unit pixels includes a first group disposed in a first row and a second group disposed in a second row spaced apart from the first row. The first group includes a first light emitting area emitting a first light, and a second light emitting area emitting a second light. The second group includes a light receiving area and third and fourth light emitting areas spaced apart from each other with the light receiving area interposed therebetween and emitting the third light. The fourth light emitting area of the first unit pixel and the third light emitting area of the second unit pixel are spaced apart from each other by a distance from about 25 micrometers to about 100 micrometers in the first direction.

    ETCHING DEVICE AND ETCHING METHOD USING THE SAME

    公开(公告)号:US20220223436A1

    公开(公告)日:2022-07-14

    申请号:US17501374

    申请日:2021-10-14

    Abstract: An etching device includes a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part. The etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220140062A1

    公开(公告)日:2022-05-05

    申请号:US17465468

    申请日:2021-09-02

    Inventor: DUCKJUNG LEE

    Abstract: A method of manufacturing a display device includes forming a sacrificial layer on a carrier substrate, forming a first base layer on the carrier substrate that surrounds the sacrificial layer and includes a different material from the sacrificial layer, forming pad electrodes on the first base layer that contact the sacrificial layer, forming a pixel structure on the first base layer that is electrically connected to the pad electrodes, separating the carrier substrate from the first base layer and the sacrificial layer, removing the sacrificial layer to expose the pad electrodes, and attaching a conductive film under the pad electrodes that contacts the pad electrodes.

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