公开(公告)号：US20240284705A1

公开(公告)日：2024-08-22

申请号：US18486396

申请日：2023-10-13

Applicant: Samsung Display Co., Ltd.

Inventor： Kiseok Choi ,  Myounggeun Cha ,  Jongjun Baek ,  Heekyun Shin ,  Yonghoon Yang

IPC: H10K59/121 ,  H10K59/12 ,  H10K59/122

CPC classification number: H10K59/1213 ,  H10K59/1201 ,  H10K59/122 ,  H10K2102/103

Abstract: A display apparatus includes: a first substrate including a polymer resin; a first barrier layer on the first substrate and including a portion doped with ions, wherein the portion includes an upper surface of the first barrier layer; a second substrate on the upper surface of the first barrier layer and including a polymer resin; a buffer layer on the second substrate; a first thin-film transistor on the buffer layer; and a light-emitting diode electrically connected to the first thin-film transistor.

公开(公告)号：US11588141B2

公开(公告)日：2023-02-21

申请号：US17110138

申请日：2020-12-02

Applicant: Samsung Display Co., Ltd.

Inventor： Dongkyun Seo ,  Hyoungsik Kim ,  Heekyun Shin ,  Junho Sim

IPC: H01L51/56 ,  H01L51/00 ,  H01L27/32

Abstract: In a method of manufacturing a display apparatus, the method includes: preparing a support substrate; forming a metal oxide layer on a surface of the support substrate, the metal oxide layer comprising first charges; forming a debonding layer on a surface of the metal oxide layer, the debonding layer comprising second charges opposite to the first charges; forming a flexible substrate on a surface of the debonding layer; forming a display element and a thin film encapsulation layer on a surface of the flexible substrate, the display element comprising a thin film transistor and an organic light-emitting diode; and isolating the flexible substrate from the support substrate.

公开(公告)号：US10903241B2

公开(公告)日：2021-01-26

申请号：US16031543

申请日：2018-07-10

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Minwoo Lee ,  Byunghoon Kang ,  Heekyun Shin ,  Seungjun Moon ,  Woojin Cho

IPC: H01L27/12 ,  H01L27/32 ,  H01L51/52 ,  H01L51/00

Abstract: A system of forming a debonding layer includes a debonding layer forming device configured to form a coating layer by coating a graphene oxide layer on a support substrate. The debonding layer forming device is configured to form a debonding layer by heat-treating the coating layer. An optical measuring device is configured to classify the support substrate into a plurality of cell areas. The optical measuring device is configured to measure a thickness of at least one of the coating layer in at least one cell area of the plurality of cell areas.

公开(公告)号：US20200047369A1

公开(公告)日：2020-02-13

申请号：US16427498

申请日：2019-05-31

Applicant: Samsung Display Co., Ltd.

Inventor： Junho Sim ,  Byunghoon Kang ,  Seungjun Moon ,  Dongkyun Seo ,  Heekyun Shin ,  Woojin Cho

IPC: B26F3/00 ,  B26D7/18

Abstract: A cutting apparatus includes: a stage on which is disposed a preliminary stacked body from which a cut stacked body having an edge is formed; a cutting unit movable along a first direction corresponding to an extension direction of the edge of the cut stacked body and with which the preliminary stacked body is cut to form the cut stacked body; a first detaching unit movable in a direction forming an acute angle with the first direction and including a first detaching tool which contacts the cut stacked body in detaching of the cut stacked body from the carrier substrate; and a second detaching unit movable in a direction parallel to the first direction and including a second detaching tool which is inserted between the cut stacked body and the carrier substrate in the detaching of the cut stacked body from the carrier substrate.