公开(公告)号：US08716854B2

公开(公告)日：2014-05-06

申请号：US13690771

申请日：2012-11-30

Applicant: SK hynix Inc.

Inventor： Ki Young Kim ,  Myung Gun Park

IPC: H01L23/02

CPC classification number: H01L23/5384 ,  H01L23/3128 ,  H01L23/495 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/73 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A multi-chip package includes a main substrate; a plurality of first semiconductor chips stacked on an upper surface of the main substrate and having bonding pads which are electrically connected with the main substrate; and a semiconductor package attached to side surfaces of the stacked first semiconductor chips and electrically connected with the main substrate.

Abstract translation: 多芯片封装包括主基板; 多个第一半导体芯片，堆叠在主基板的上表面上并具有与主基板电连接的接合焊盘; 以及附接到堆叠的第一半导体芯片的侧表面并与主基板电连接的半导体封装。