公开(公告)号：US20240208005A1

公开(公告)日：2024-06-27

申请号：US18226873

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jubong LEE ,  Jongsu KIM ,  Sungyong PARK ,  Bongki PARK ,  Eunsun PARK ,  Hyunjoon PARK ,  Hoseop CHOI

IPC: B24B53/017 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B37/005 ,  B24B37/04

Abstract: A cleaner for a CMP apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. The cleaning body may be arranged under a polishing head of the CMP apparatus configured to hold a substrate. The cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. The cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. The vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. The controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. Thus, a scratch caused by a defect may not be generated at the substrate.

公开(公告)号：US20210341396A1

公开(公告)日：2021-11-04

申请号：US17116708

申请日：2020-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Sungha KIM ,  Hyounggon KIM ,  Doohyun CHO ,  Kwangsung LEE ,  Jongsu KIM ,  Taejoong KIM ,  Jeongsu HA

IPC: G01N21/95 ,  G01B11/06

Abstract: A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.