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11.Low resistance bonds to germaniumsilicon bodies and method of making such bonds 失效
Title translation: 与锗硅体的低电阻键和制造这种键的方法公开(公告)号:US3342567A
公开(公告)日:1967-09-19
申请号:US33389563
申请日:1963-12-27
Applicant: RCA CORP
Inventor: DINGWALL ANDREW G F
IPC: H01L21/00
CPC classification number: H01L21/00 , Y10S228/903 , Y10T29/49204 , Y10T428/12528 , Y10T428/12576 , Y10T428/12674 , Y10T428/1284 , Y10T428/31678