公开(公告)号：US10189554B1

公开(公告)日：2019-01-29

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B60H3/00 ,  B64C1/06 ,  B64C39/02 ,  B64C1/00

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US11616185B2

公开(公告)日：2023-03-28

申请号：US15611524

申请日：2017-06-01

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Victor Adrian Chiriac ,  Mario Francisco Velez ,  Peng Wang

IPC: H01L35/32 ,  H01L35/02 ,  H01L35/30 ,  H01L35/34

Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.

公开(公告)号：US20160334845A1

公开(公告)日：2016-11-17

申请号：US14709276

申请日：2015-05-11

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Hee Jun Park ,  Peng Wang ,  Mehdi Saeidi ,  Arpit Mittal

IPC: G06F1/20 ,  H01L25/10

CPC classification number: G06F1/206 ,  G01K7/04 ,  G05D23/1906 ,  H01L23/34 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1094 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

Abstract translation: 封装封装（PoP）器件包括第一封装，第二封装和双向热电冷却器（TEC）。 第一封装包括第一基板和耦合到第一基板的第一管芯。 第二个包装耦合到第一个包装。 第二包装包括第二基板和耦合到第二基板的第二管芯。 TEC位于第一模具和第二基板之间。 TEC适于在第一包装和第二包装之间动态地散发热量。 TEC适于在第一时间段内将热量从第一管芯散热到第二管芯。 TEC进一步适于在第二时间段内将热量从第二管芯传送到第一管芯。 TEC适于通过第二衬底将热量从第一裸片散发到第二裸片。