公开(公告)号：US20230007783A1

公开(公告)日：2023-01-05

申请号：US17783206

申请日：2020-11-27

Applicant: NITTO DENKO CORPORATION

Inventor： Masaki ITO ,  Hayato TAKAKURA ,  Kenya TAKIMOTO

IPC: H05K3/06

Abstract: A method for producing a wiring circuit board includes first forming a base insulating layer, and second forming a first wiring and a second wiring having different thicknesses from each other in order. The second step includes, in order, forming a seed film, forming a first resist in a reversed pattern of the first wiring on one surface in a thickness direction of the seed film, forming the first wiring on one surface in the thickness direction of the seed film by plating, removing the first resist, of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film to cover the first wiring, forming the second wiring on one surface in the thickness direction of the seed film by plating, removing the second resist, and removing the seed film.