公开(公告)号：US20100206849A1

公开(公告)日：2010-08-19

申请号：US12657928

申请日：2010-01-29

Applicant: Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

Inventor： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC: B21F99/00

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

公开(公告)号：US07686204B2

公开(公告)日：2010-03-30

申请号：US11645943

申请日：2006-12-27

Applicant: Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

Inventor： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC: B23K31/02 ,  B23K37/00

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

公开(公告)号：US20070187138A1

公开(公告)日：2007-08-16

申请号：US11645943

申请日：2006-12-27

Applicant: Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

Inventor： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC: H05K1/09 ,  H05K3/30

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

Abstract translation: 一种引线接合装置，包括具有用于检测第一接合点和接合线之间的非接合的非电接触检测器，光学非接合检测器和光学形状检测器的接合控制部分; 并且当通过电非接合检测器检测到非接合时，也通过光学非粘合检测器检测非粘合，然后基于顶端的形状将接合线的末端重新形成 由光学形状检测器检测到的接合线，将球形成装置成为规定形状的球，并且在第一接合点进行重新接合。

公开(公告)号：US20100133322A1

公开(公告)日：2010-06-03

申请号：US12657913

申请日：2010-01-29

Applicant: Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

Inventor： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC: B23K20/00 ,  B23K37/00

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

Abstract translation: 一种引线接合装置，包括具有用于检测第一接合点和接合线之间的非接合的非电接触检测器，光学非接合检测器和光学形状检测器的接合控制部分; 并且当通过电非接合检测器检测非接合时，也可以通过光学非粘合检测器检测非接合，然后基于尖端的形状来改变接合线的末端 由光学形状检测器检测到的接合线，将球形成装置设置成规定形状的球，并且在第一接合点进行重新接合。

公开(公告)号：US06542783B2

公开(公告)日：2003-04-01

申请号：US09782889

申请日：2001-02-12

Applicant: Kuniyuki Takahashi ,  Shinji Maki

Inventor： Kuniyuki Takahashi ,  Shinji Maki

IPC: G15B1918

CPC classification number: H01L24/85 ,  B23K20/10 ,  G05B19/4015 ,  G05B2219/37555 ,  G05B2219/45033 ,  G05B2219/50033 ,  G05B2219/50035 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/78703 ,  H01L2224/78801 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Abstract translation: 为了实现例如引线接合装置中的接合工具位置的精确检测，通过将参考孔成像（例如）通过将参考孔成像，来测量位置检测摄像机和形成在例如钳位器中的参考孔之间的位置关系 位置检测摄像机。 位置检测摄像机和接合工具通过XY工作台移动，接合工具的前端插入到基准孔中。 然后，接合工具沿X和Y方向移动，并且基于施加到接合工具的超声波振动的波形的变化来检测接合工具与参考孔的边缘的接触，从而测量位置 工具与参考孔之间的关系。 然后基于测量值和粘合工具在这些测量值的位置之间的移动量来确定位置检测摄像机和接合工具之间的偏移量。