公开(公告)号：US20140109035A1

公开(公告)日：2014-04-17

申请号：US14043197

申请日：2013-10-01

Applicant: MEDIATEK INC.

Inventor： Fu-Kang PAN ,  Nan-Cheng CHEN ,  Shih-Chieh LIN ,  HUI-CHI TANG ,  Ying LIU ,  Yang LIU

IPC: G06F17/50

CPC classification number: G06F17/5072 ,  G06F17/5068 ,  G06F17/5077 ,  G06F2217/12 ,  G06F2217/38 ,  G06F2217/40

Abstract: A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

Abstract translation: 提供了印刷电路板（PCB）的布局方法。 获得要安装在PCB上的动态随机存取存储器（DRAM）的存储器类型。 根据DRAM的存储器类型从数据库获得模块组，其中模块组包括多个路由模块。 获得多个PCB参数。 根据PCB参数从模块组中选择一个特定的路由模块。 具体的路由模块被实现为PCB的布局设计。 特定路由模块包括关于主芯片，存储芯片以及主芯片和存储芯片之间的路由配置的布局信息。

公开(公告)号：US20130220690A1

公开(公告)日：2013-08-29

申请号：US13747738

申请日：2013-01-23

Applicant: MEDIATEK INC.

Inventor： Sheng-Ming CHANG ,  Shih-Chieh LIN ,  Nan-Cheng CHEN

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K2201/0723 ,  H05K2201/09672 ,  H05K2201/09709 ,  H05K2201/10522 ,  H05K2201/10674

Abstract: The invention provides a printed circuit board for mobile platforms. An exemplary embodiment of the printed circuit board for mobile platforms includes a core substrate having a first side. A ground plane covers the first side. A first insulating layer covers the ground plane. A plurality of first signal traces and a plurality of first ground traces are alternatively arranged on the first insulating layer. A second insulating layer connects to the first insulating layer. A plurality of second signal traces separated from each other is disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto.

Abstract translation: 本发明提供一种用于移动平台的印刷电路板。 用于移动平台的印刷电路板的示例性实施例包括具有第一侧的芯基板。 地平面覆盖第一面。 第一绝缘层覆盖接地层。 多个第一信号迹线和多个第一接地迹线交替地布置在第一绝缘层上。 第二绝缘层连接到第一绝缘层。 彼此分离的多个第二信号迹线设置在第二绝缘层上，其中第二信号迹线直接设置在第一信号迹线和与其相邻的第一接地迹线之间的空间上。